circuit
Key words:
Features of thick copper circuit boards: 1. Thick copper circuit boards have high assembly density and small size. The thick copper circuit board is convenient for wiring, shortens the wiring length and the wiring between components, and helps to improve the signal transmission speed. 3. For high-frequency circuits, after adding a ground layer, the signal line and the ground layer form a constant low impedance, the circuit impedance is greatly reduced, and the shielding effect is good. 4. For electronic products with high heat dissipation requirements, thick copper circuit boards can be equipped with a metal core heat dissipation layer to meet the needs of special functions such as shielding and heat dissipation. 5. In terms of performance, thick copper circuit boards are better than single-sided and double-sided circuit boards, but the higher the number of layers, the higher the manufacturing cost, the longer the processing time, and the more complicated the quality inspection. 6. Four-layer or six-layer boards are common in thick copper circuit boards. The difference between the four-layer board and the six-layer board is that there are two internal signal layers between the middle layer, the ground layer and the power layer. The six-layer board is thicker than the four-layer board.
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8-layer board multilayer circuit board multilayer printed circuit board circuit board factory
Number of layers: 8 layers plate thickness: 1.2MM minimum line width line distance: 3MIL/4MIL minimum through hole: 0.2MM hole to line distance: 7MIL surface treatment: gold sinking application field: automotive electronics
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16-layer multilayer circuit board multilayer circuit board factory multilayer circuit board
Number of layers: 16 layers plate thickness: 2.0MM minimum line width line spacing: 4MIL/4MIL minimum through hole: 0.25MM surface treatment: security equipment for gold sinking applications
Key words:
12-layer board multilayer circuit board multilayer circuit board multilayer printed circuit board
Number of layers: 12 layers plate thickness: 1.6MM minimum line width line spacing: 3MIL/4MIL minimum through hole: 0.2MM hole to line distance: 7MIL surface treatment: communication equipment in gold sinking applications
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