What is the process flow of thick copper circuit board
thick copper circuit board, even some new peers in the industry are confused. When inquiring, customers often say that the circuit board is very simple, and you can tell the price. In fact, the processing process of the thick copper circuit board depends on the number of layers, the number of vias, the line width and the line distance of the thick copper circuit board. Some large companies need two days to review the thick copper circuit board documents. For example, the combination of hardware and software boards, the requirements for the machine, and the company's management level are inseparable. Whether it is simple or complex, let's talk about the manufacturing process of thick copper circuit boards:
1. Cutting
Purpose: According to the requirements of engineering data mi, cut into small pieces, and produce plates on large boards that meet the requirements. Small pieces to meet customer requirements.
process: large plate → plate cutting according to MI requirements → coulomb plate → beer sheet/edging → hair plate.
2. Drilling
Purpose: According to the engineering data, drill the required hole diameter at the corresponding position on the board according to the required size.
Process: Laminate pin → upper plate → drill hole → lower plate → check and repair.
3. Copper Precipitation
Purpose: Copper deposition is to chemically deposit a thin layer of copper on the walls of insulating holes.
process: rough grinding → hanging plate → automatic sinking copper wire → lower plate → dipping% diluted H2SO4 → thickening copper.
4. Graphics processing
Intent: Graphics processing is to transfer the pictures on the production film to the circuit board.
process: (blue oil process): grinding disc → printing one side → drying → printing the second side → drying → facing → development → watching; (dry film method): hemp plate → laminating → permanent → alignment → facing → permanent → development → watching.
5. Pattern plating
Intent: Pattern plating is to plate a copper layer with a required thickness and a gold nickel or tin layer with a required thickness on the exposed copper skin or hole wall of the line pattern.
process: upper plate → degreasing → secondary water washing → micro etching → water washing → acid washing → copper plating → water washing → acid washing → tin plating → water washing → lower plate.
6. Film removal
Application: Remove the anti-plating layer with sodium hydroxide solution to expose the non-wire copper layer.
Process: Water film: inserting frame → alkali immersion → scouring → wiping → passing machine; dry film: placing plate → passing machine.
7. Etching
Purpose: Etching is the use of chemical reaction methods to corrode the copper layer of non-linear parts.
8. Green
Purpose: Green oil is to transmit the graphics of the green film to the circuit board to maintain the circuit and prevent tin from appearing on the circuit when soldering parts.
process: grinding disc → printing photosensitive green oil → coulomb plate → facing → development; grinding disc → printing the first side → drying plate → printing the second side → drying plate.
9 Character
Intent: Characters are provided with easy-to-identify marks.
Process flow: After finishing with green oil → cooling and standing → screen adjustment → printing characters → post-coulomb.
10. Gold-plated Finger
Purpose: Nickel/gold layer is plated on the insert finger according to the required thickness to make it harder and wear-resistant.
process: upper plate → degreasing → secondary water washing → micro etching → secondary water washing → pickling → copper plating → water washing → nickel plating → water washing → gold plating.
Purpose: Tin spray is to spray a layer of lead tin on the exposed copper surface that is not coated with solder resist oil to keep the copper surface from corrosion and oxidation, thereby ensuring good welding performance.
process: micro etching → air drying → preheating → rosin coating → solder coating → hot air leveling → air cooling → washing and air drying.
thick copper circuit board
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Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
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