Most electronic products are inseparable from the multi-layer circuit board, and the production quality of the multi-layer circuit board factory directly determines the use effect and quality of the electronic equipment. There are many points in the circuit board processing related to the multi-layer circuit. The compatibility of the board affects the quality of the circuit board. Today, what are the key points of multi-layer circuit board compatibility design under popular science? _Multilayer Circuit Board_Multilayer Circuit Board Factory_Blind Buried Circuit Board_HDI Board Proofing

1. The compatibility of circuit boards is mainly reflected in electromagnetic compatibility, and electromagnetic compatibility can be understood as the ability of circuit boards to maintain coordinated and effective work in various electromagnetic environments. The first thing that affects the electromagnetic compatibility of circuit boards is the wire. Width, the width of the wire determines the inductance component of the printed wire, and the inductance component determines the impact interference ability of the transient current on the circuit board. Therefore, the reasonable selection of the wire width by the multilayer circuit board factory can reduce the electromagnetic interference to a very low level. . _Multilayer Circuit Board_Multilayer Circuit Board Factory_Blind Buried Circuit Board_HDI Board Proofing

2. In addition to the printed wires that can affect the inductance in the multi-layer circuit board factory, the wiring on the circuit board also affects the inductance. For example, the more common is equal routing, which can reduce the inductance, but the disadvantage is that the mutual inductance of the wires increases, and the number of capacitors needs to be increased. Therefore, the multilayer circuit board factory should choose according to the specific situation when designing the circuit board. The most reasonable wiring will do. _Multilayer Circuit Board_Multilayer Circuit Board Factory_Blind Buried Circuit Board_HDI Board Proofing

3. In addition to the inductance mentioned just now, the crosstalk between the wires affects the compatibility of the circuit board. In this regard, the multi-layer circuit board manufacturers still need to pay attention to the wiring. For example, the equal wiring just mentioned should be avoided as much as possible. Long-distance and equal wiring, and then try to increase the distance between the line and the line, and the signal line, the ground line and the power line should not cross, if there are very sensitive signal lines, in order to avoid crosstalk, you can add a suppression line , This can also effectively suppress crosstalk. _Multilayer Circuit Board_Multilayer Circuit Board Factory_Blind Buried Circuit Board_HDI Board Proofing

The design techniques mentioned just now are all effective ways to increase the compatibility of circuit boards, and the experienced multi-layer circuit board manufacturers also remind everyone that the design of circuit boards must also be combined with specific electronic products. Only by designing according to the actual situation Achieve better compatibility of multilayer circuit boards. _Multilayer Circuit Board_Multilayer Circuit Board Factory_Blind Buried Circuit Board_HDI Board Proofing