Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
multilayer circuit board factory
directly determines the use effect and quality of electronic equipment. There are many key points in circuit board processing related to the compatibility of multilayer circuit board, which in turn affects the quality of circuit board. Today, multilayer circuit board factory will popularize science. what are the key points of multilayer circuit board compatibility design?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
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. the compatibility of circuit board is mainly reflected in electromagnetic compatibility, which can be understood as the ability of circuit board to maintain coordinated and effective work in various electromagnetic environments. first of all, the width of wires affects the electromagnetic compatibility of circuit board, the width of the wire determines the inductance component of the printed wire, and the inductance component determines the impact interference capability of the transient current on the circuit board. Therefore, the reasonable selection of the wire width of
multilayer circuit board factory can reduce the electromagnetic interference to a very low level. _multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing 2
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multilayer circuit board factory besides printed wires can affect inductance, wiring on circuit board can also affect inductance. For example, the more common is the equal routing, which can play a role in reducing inductance, but the disadvantage is that the wire mutual inductance increases, but also increases the number of capacitors, so the multilayer circuit board factory in the design of the circuit board, should choose the most reasonable wiring according to the specific situation. _multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing 3
. besides the inductance mentioned just now, crosstalk between wires also affects the compatibility of circuit board. in this respect,
multilayer circuit board factory still needs to pay attention to wiring. for example, the equal wiring mentioned just now should avoid long-distance equal wiring as much as possible, then try to increase the distance between the line and the line, and the signal line and the ground line and the power line do not cross, if there is a very sensitive signal line, in order to avoid crosstalk can add a suppression line, which can also effectively suppress crosstalk. _multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
just mentioned are all design techniques to effectively increase the compatibility of circuit boards, while senior
multilayer circuit board factory
also reminds everyone that the design of circuit boards should be combined with specific electronic products, only according to the actual situation to design can make multi-layer circuit board compatibility better. _multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
Multi-layer circuit board factory, multi-layer circuit board, multi-layer circuit board, blind buried hole circuit board, HDI board proofing
The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
2023-07-28
The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
2023-07-28
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
2023-07-28
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
2023-07-28
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
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