16-layer board Multi-layer circuit board Multi-layer circuit board factory Multi-layer circuit board
Product parameters:
Number of layers: 16-layer board
Board thickness: 2.0MM
Minimum line width and distance: 4MIL/4MIL
Minimum through hole: 0.25MM
Surface treatment: Immersion gold
Application field: Security equipment
As a kind of multi-layer board, 16-layer board also has the advantages of multi-layer board:
1. High assembly density and small size;
2. The connection between electronic components is shortened and the signal transmission speed is increased;
3. Convenient wiring;
4. For high frequency circuits, add a ground layer to make the signal line form a constant low impedance to the ground;
5. Good shielding effect.
Relatively speaking, 16-layer boards also have shortcomings, such as: more layers, high cost, longer processing cycle, and more troublesome quality inspection.
Shenzhen Hengkesheng Electronics Co., Ltd. is an emerging high-tech enterprise. As a professional multi-layer circuit board factory, its main products are multilayer circuit boards, HDI board proofing, HDI circuit boards, blind buried via circuit boards, rigid-flex circuit boards, PCB circuit board proofing, ceramic circuit boards, and high-density connection boards. , Multilayer printed circuit boards, etc. Specially provide superior and fast service for domestic and foreign high-tech enterprises and scientific research units. Hengkesheng Electronics has been selected as the annual outstanding supplier of many well-known enterprises at home and abroad. It is a private technology enterprise recognized by the Shenzhen Municipal Science and Technology Bureau. At the same time, the company has worked together in the development process to create an excellent culture and an excellent enterprise. Adhere to the spirit of perseverance and continue to absorb emerging international technologies. Improve product quality and exceed customer needs.
产品中心
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Number of floors: 16 floors Board thickness: 2.0MM Minimum line width and distance: 4MIL/4MIL Minimum through hole: 0.25MM Surface treatment: Immersion gold Application field Security equipment16-layer board Multi-layer circuit board Multi-layer circuit board factory Multi-layer circuit board0.00Number of floors: 16 floors Board thickness: 2.0MM Minimum line width and distance: 4MIL/4MIL Minimum through hole: 0.25MM Surface treatment: Immersion gold Application field Security equipment -
Number of floors: 12 floors Board thickness: 1.6MM Minimum line width and line spacing: 3MIL/4MIL Minimum through hole: 0.2MM Distance from hole to line: 7MIL Surface treatment: Immersion gold Application field communication device12-layer board Multi-layer circuit board Multi-layer circuit board Multi-layer printed circuit board0.00Number of floors: 12 floors Board thickness: 1.6MM Minimum line width and line spacing: 3MIL/4MIL Minimum through hole: 0.2MM Distance from hole to line: 7MIL Surface treatment: Immersion gold Application field communication device -
Number of floors: 10 floors Board thickness: 1.6MM Minimum line width and line spacing: 3MIL/4MIL Minimum through hole: 0.2MM Surface treatment: Immersion gold Application field: medical equipment10-layer board Multi-layer circuit board Soft-hard combined circuit board Multi-layer circuit board0.00Number of floors: 10 floors Board thickness: 1.6MM Minimum line width and line spacing: 3MIL/4MIL Minimum through hole: 0.2MM Surface treatment: Immersion gold Application field: medical equipment
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National Service Hotline：
86-755-29615096
Fax：86-755-27691537
Mail：csaa@hengkepcb.com
Address：No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province
Copyright: Shenzhen Hengkesheng Electronics Co., Ltd. 备案号：粤ICP备08029233号
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