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16-layer multilayer circuit board multilayer circuit board factory multilayer circuit board

Number of layers: 16 layers plate thickness: 2.0MM minimum line width line spacing: 4MIL/4MIL minimum through hole: 0.25MM surface treatment: security equipment for gold sinking applications


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Commodity Description


Product Parameters:

Layer: 16 Layer Board

Plate Thickness: 2. 0MM
Minimum Line Width Line Distance: 4MIL/4MIL
Minimum Through Hole: 0. 25MM
Surface Treatment: Shen Jin

Application Field: Security Equipment

 

16 Layer Board as a kind of multilayer board, it also has the advantages of multilayer board:

1. High assembly density and small volume;

2. Shorten the connection between electronic components and improve the signal transmission speed;

3. Convenient wiring;

4. For high-frequency circuits, add a ground wire layer to make the signal wire form a constant low impedance to the ground;

5. Good shielding effect.

 

16-layer board is also relatively insufficient, such as: many layers, high cost, longer processing cycle, quality inspection is more troublesome.

 

Shenzhen Hengke Sheng Electronics Co., Ltd. is a new high-tech enterprises. As a professional multi-layer circuit board factory, the main products are multi-layer circuit board, HDI board proofing, HDI circuit board, blind buried hole circuit board, soft and hard combination circuit board, pcb circuit board proofing, ceramic circuit board, high density connection board, multi-layer printed circuit board, etc. Specially for domestic and foreign high-tech enterprises and scientific research units to provide superior fast service. Hengkesheng Electronics has been selected as the annual outstanding supplier of many well-known enterprises at home and abroad. It is a private technology enterprise recognized by the Shenzhen Municipal Science and Technology Bureau. At the same time, the company has worked together in the development process and is committed to creating excellent culture and excellent enterprises. Adhere to the spirit of perseverance, and constantly absorb international emerging technologies. Improve product quality and exceed customer needs.

 

 

 

 

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