10-layer board Multi-layer circuit board Soft-hard combined circuit board Multi-layer circuit board
Product parameters:
Number of floors: 10 floors
Board thickness: 1.6MM
Minimum line width and line spacing: 3MIL/4MIL
Minimum through hole: 0.2MM
Surface treatment: Immersion gold
Application field: medical equipment
Shenzhen Hengkesheng Electronics Co., Ltd. is an emerging high-tech enterprise. As a professional multi-layer circuit board factory, its main products are multilayer circuit boards, HDI board proofing, HDI circuit boards, blind buried via circuit boards, rigid-flex circuit boards, PCB circuit board proofing, ceramic circuit boards, and high-density connection boards. , Multilayer printed circuit boards, etc.
Three reasons for choosing Hengkesheng:
1. Company strength: Hengkesheng Electronics was selected as the annual outstanding supplier of many well-known enterprises at home and abroad, and it is a private technology enterprise recognized by the Shenzhen Municipal Science and Technology Bureau. At the same time, the company is working together in the development process and is committed to creating an excellent culture , Excellent enterprise. Adhere to the spirit of perseverance and continue to absorb emerging international technologies. Improve product quality and exceed customer needs.
2. Quality assurance: relying on management for quality, relying on quality for credibility, credibility for the market, and market for development; the company's quality commitments: guarantee quality, guarantee quantity, guarantee delivery time, and guarantee service.
3. Intimate service: customer service responds quickly, keeping emails, phone calls, and face-to-face communication links fast and smooth throughout the entire process, reducing communication costs in an all-round way, and improving communication efficiency. In the event of an emergency, an active customer return visit will be carried out immediately, allowing you to enjoy a more intimate after-sales service.
产品中心
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Number of floors: 12 floors Board thickness: 1.6MM Minimum line width and line spacing: 3MIL/4MIL Minimum through hole: 0.2MM Distance from hole to line: 7MIL Surface treatment: Immersion gold Application field communication device12-layer board Multi-layer circuit board Multi-layer circuit board Multi-layer printed circuit board0.00Number of floors: 12 floors Board thickness: 1.6MM Minimum line width and line spacing: 3MIL/4MIL Minimum through hole: 0.2MM Distance from hole to line: 7MIL Surface treatment: Immersion gold Application field communication device -
Number of floors: 10 floors Board thickness: 1.6MM Minimum line width and line spacing: 3MIL/4MIL Minimum through hole: 0.2MM Surface treatment: Immersion gold Application field: medical equipment10-layer board Multi-layer circuit board Soft-hard combined circuit board Multi-layer circuit board0.00Number of floors: 10 floors Board thickness: 1.6MM Minimum line width and line spacing: 3MIL/4MIL Minimum through hole: 0.2MM Surface treatment: Immersion gold Application field: medical equipment
WRITE A MESSAGE TO US
National Service Hotline：
86-755-29615096
Fax：86-755-27691537
Mail：csaa@hengkepcb.com
Address：No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province
Copyright: Shenzhen Hengkesheng Electronics Co., Ltd. 备案号：粤ICP备08029233号
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