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Ultra-thick board Blind buried via circuit board HDI circuit board HDI board proofing

Ultra-thick board Blind buried via circuit board HDI circuit board HDI board proofing

Number of floors: 4 floors Board thickness: 5.0MM Minimum line width and distance: 5MIL/5MIL Minimum through hole: 1.0MM Surface treatment: Immersion gold Application field Wind power equipment
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Product description
Parameters

Number of floors: 4 floors
Board thickness: 5.0MM
Minimum line width and distance: 5MIL/5MIL
Minimum through hole: 1.0MM
Surface treatment: Immersion gold


Application field
Wind power equipment

Keyword:
5mil
floors
minimum
through
treatment
distance
surface
thickness
immersion
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