4-layer board Multilayer circuit board Multilayer circuit board factory Circuit board factory
Product parameters:
Number of layers: 4-layer board
Board thickness: 1.0MM
Minimum line width and distance: 3MIL/3MIL
Minimum through hole: 0.2MM
Surface treatment: Immersion gold
Application areas: automotive electronics
A 4-layer board usually consists of 2 signal layers, a power plane layer and a ground plane layer.
4-layer laminate design scheme 1:
Stacked design: TOP, GND02, PWR03, BOTTOM
This stacking design scheme is the first choice in the PCB four-layer board design. There is a complete ground plane under the main component surface (TOP layer), which is the optimal wiring layer. When the layer thickness is set, the thickness of the core board between the ground plane layer and the power plane layer should not be too thick, so as to reduce the distributed impedance of the power supply and the ground plane and ensure the filtering effect of the plane capacitor.
4-layer laminate design scheme two:
Stacked design: TOP, PWR02, GND03, BOTTOM
If the main component is designed on the BOTTOM layer or the key signal lines are laid on the BOTTOM layer, a complete ground plane must be arranged on the third layer. When the layer thickness is set, the thickness of the core board between the ground plane layer and the power plane layer should not be too thick.
4-layer laminate design scheme three:
Stacked design: GND01, S02, S03, GND04/PWR04
This solution is usually applied to the design of interface filter boards and backplanes. Since the entire board has no power plane, the first and fourth layers of GND and PGND are arranged. The surface layer (TOP layer) only allows a small number of short wires to be taken. Similarly, we lay copper on the S02 and S03 wiring layers to ensure the reference plane of the surface wiring and control the stacking symmetry.
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