4-layer multilayer circuit board multilayer circuit board factory circuit board factory
Number of layers: 4 layers of plate thickness: 1.0MM minimum line width line spacing: 3MIL/3MIL minimum through hole: 0.2MM surface treatment: gold sinking application: automotive electronics
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Commodity Description
Product Parameters:
Layer: 4 Layer
Plate Thickness: 1. 0MM
Minimum Line Width Line Distance: 3MIL/3MIL
Minimum Through Hole: 0. 2MM
Surface Treatment: Dumped Gold
Application Field: automotive Electronics
4-layer board usually consists of 2 signal layers, 1 power plane layer and 1 ground plane layer.
4-layer laminate design scheme 1:
laminate design: TOP, GND02, PWR03, BOTTOM
This laminate design scheme is the first choice in PCB four-layer laminate design. There is a completed ground plane under the main component surface (TOP layer), which is the optimal wiring layer. When the layer thickness is set, the thickness of the core plate between the ground plane layer and the power plane layer should not be too thick, so as to reduce the distribution impedance of the power supply and the ground plane and ensure the filtering effect of the plane capacitor.
4-layer laminate design scheme 2:
laminate design: TOP, PWR02, GND03, BOTTOM
If the main component is designed on the BOTTOM layer or the key signal line is distributed on the BOTTOM layer, a complete ground plane shall be arranged on the third layer. When the layer thickness is set, the thickness of the core plate between the ground plane layer and the power plane layer should not be too thick.
4-layer laminate design scheme 3:
laminate design: GND01, S02, S03, GND04/PWR04
this scheme is usually applied to the design of interface filter board and backplane. since the whole version has no power plane, GND and PGND elder brother arrange the first and fourth layers. Only a small number of short lines are allowed on the surface layer (TOP layer). Similarly, we spread copper on the S02 and S03 wiring layers to ensure the reference plane of the surface wiring and control the symmetry of the lamination.
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