Industry News_News_CSAA LIMITED_Electronic electrician_Service Area

2021-03-18

Factors affecting the price of soft and hard circuit boards

The main factors that affect the price of soft and hard circuit boards are cost structure and market structure. The cost structure is affected by internal factors such as raw materials, labor prices and product technical requirements, and the market structure is affected by external factors such as macroeconomic conditions, supply market competition, technological development level and regulatory restrictions.

2021-01-12

Rigid-flex board production process and advantages and disadvantages

The birth and development of FPC and PCB gave birth to the new product of flexible and hard board. Therefore, the flexible and hard board is the process of pressing the flexible circuit board and the rigid circuit board, and combining them according to the relevant process requirements to form a FPC characteristic. Circuit board with PCB characteristics.

2021-01-03

Blind and buried via circuit board processing technology

HDI means high-density interconnection, and HDI board is a blind buried via circuit board. Blind hole refers to a hole in the inside that can be seen from the outside, but there is no penetration, and the road slab with lines cannot be seen on the other side; a buried hole is a hole that only exists in the inner layer and is completely invisible from the outside.

2020-12-10

Difficulties in the production of multilayer circuit boards

Multilayer circuit boards generally refer to circuit boards with three or more layers, which require high quality and reliability. Mainly used in communication equipment, high-end servers, medical electronics, aviation, industrial control, military and other fields. In recent years, the market demand for multilayer circuit boards in applied communications, base stations, aviation, military and other fields is still strong. With the rapid development of my country's telecommunications equipment market, the market prospects for multilayer circuit boards are broad.

2020-12-09

How much do you know about multilayer circuit boards?

A multilayer circuit board is a circuit board made up of two or more conductive layers (copper layers) superimposed on each other. The copper layers are bonded together by a resin layer (prepreg). Drilling and plating have been completed. Multi-substrates are manufactured by stacking two or more circuits together with reliable preset interconnections between them. This technique violated the conservative production process from the beginning. The two innermost layers consist of traditional double-layer panels, while the outer layers are different. Before rolling, the internal substrate will be drilled, plated through holes, transferred, developed and etched. The outer layer drilled is the signal layer, which is electroplated by forming a balanced copper ring on the inner edge of the through hole, and then

2020-12-09

The role of multilayer circuit boards

Multilayer circuit boards are generally used for high-speed PCB design. Multilayer circuit boards are actually formed by laminating and bonding several etched single or double panels. Compared with single-layer or double-layer circuit boards, multilayer circuit boards have many advantages, especially in small-volume electronic products. Let us share the advantages of multilayer circuit boards.

2020-12-08

The future development trend of ceramic circuit boards

The ceramic circuit board industry has developed for many years and has matured. At present, the overall market structure is clear. Domestic manufacturers such as Stone, Swissby, Gaoxin, and Tongxin are leading the way, and small and medium-sized manufacturers have begun to flood in, indicating that the market is booming. Although the ceramic circuit board is no longer a new product, its application in China has just started. Many small and medium-sized manufacturers have started the application of ceramic circuit boards. Compared with other printed circuit boards, ceramic circuit boards can be used as substitutes for older generation substrates, and can perfectly replace metal substrates and transparent substrates. Because of its high thermal conductivity, high insulation, and good thermal expansion matching coefficient, it has become a hot spot in the field of high-power lighting.

2020-12-08

The application fields of ceramic circuit boards are getting wider and wider

Compared with other organic circuit boards, ceramic circuit boards have obvious advantages such as high thermal conductivity and good thermal expansion coefficient matching. At present, it has obtained good and stable applications in the fields of automotive sensors and high-end lighting, and its product performance is particularly outstanding; the output has gradually stabilized, increasing year by year, and recently there has been a small outbreak; the technology is becoming more perfect, and it has been patented in China, which can make metal layers and ceramics Combining in ionic state is higher than other methods such as copper plating and printing.

2020-12-07

This article takes you to know HDI board proofing

In today's safe and convenient living conditions, many new products have been produced accordingly. Today we will mainly talk about HDI board and HDI board proofing process. HDI is an abbreviation for high-density interconnection, and it is also a technology for printed circuit boards. It is mainly based on a circuit of micro-blind and buried vias to distribute high-density circuit boards. HDI is specially designed for small-capacity users, because it is based on compact products, and adopts modular and parallel design. In most cases, it uses various patented technologies and digital signal processing technologies, and has strong shortcomings. Time overload capacity and in the global scale

2020-12-07

What should I prepare for HDI board proofing?

With the continuous development of current electronic products in the direction of high density and high precision, the requirements for product parts are becoming more and more stringent. The emergence of HDI boards meets the electronic performance and high efficiency indicators of these categories at the same time. It is present in popular electronic products, digital cameras and even the automotive industry.

2020-12-04

The future prospects of ceramic circuit boards can be expected

The rapid development of the Internet of Things in recent years will strongly promote the transformation and upgrading of traditional industries. Leading the rapid development of emerging industries, triggering in-depth reforms of social production and economic development. In the entire Internet of Things industry chain, MEMS sensors play an increasingly important role and play a central role in the upcoming era of intelligent Internet of Things, bringing smarter and more sensitive perception to new technology products. But there are certain difficulties, ceramic circuit boards can make up for it.

2020-11-05

Looking at the ceramic circuit board industry from the historical development

Ceramic circuit board companies, like other traditional companies, are exploring in the Internet tide, the survival of the fittest and the survival of the fittest. The now booming ceramic circuit board industry has a tendency to become the leader of the PCB industry, and the overall development process has to sigh the cruel reality. As a result, too many unsuccessful examples have disappeared in the long river of history. As a PCB manufacturer, you should know that in the progress of society, it is not only the products that keep up with the pace, but the thinking that always makes people go first.

2020-10-30

The development of ceramic circuit board industry

The ceramic circuit board industry is no longer a new industry, but it is still a thriving "boy" for China. Now the domestic ceramic circuit board industry has entered a period of rapid development. Each industry has the idea of dividing the cake, and at the same time, it has also incorporated ideas from other fields, directly bringing changes to the entire industry. The biggest change is the channel.

2020-10-21

Why use ceramic circuit boards

General PCB is made by bonding copper foil and substrate. Due to thermal stress, chemical factors, improper production process and other reasons in its processing, the PCB substrate is prone to bend to varying degrees. Another kind of PCB substrate, namely ceramic circuit board, is greatly superior to the general glass fiber PCB in terms of heat dissipation performance, energization ability, insulation, thermal expansion coefficient, etc. It is widely used in high-power electronic modules, aerospace, and military needs. Electronics and other products.

2020-10-20

Market development prospects of ceramic circuit boards

In the era when data is king, the PCB industry must also be able to keep up, and ceramic circuit boards must also be constantly updated and upgraded to keep up with the pace of the industrial revolution. With the expansion of LED downstream applications and the increase in market penetration, emerging markets such as high-value-added lighting, small-pitch displays, and automotive LEDs will bring incremental space to the industry. Driven by factors such as the expansion of production passivation in midstream packaging factories and the expansion of downstream application demand, it is speculated that LED prices are expected to rise or heat up in the future.

2020-09-28

HDI board proofing: what files are needed?

2020-09-22

PCB circuit board proofing and cutting size

2020-09-17

Blind and buried via circuit board: detailed knowledge of power battery safety

2020-09-08

Multilayer circuit board factory: the manufacturer's plate making ability

2020-09-02

Test points generated by HDI board proofing

2020-07-28

Multi-layer circuit board factory _ multi-layer circuit board compatible design key points

Most electronic products are inseparable from the multi-layer circuit board, and the production quality of the multi-layer circuit board factory directly determines the use effect and quality of the electronic equipment. There are many points in the circuit board processing related to the multi-layer circuit. The compatibility of the board affects the quality of the circuit board. Today, what are the key points of multi-layer circuit board compatibility design under popular science? _Multilayer Circuit Board_Multilayer Circuit Board Factory_Blind Buried Circuit Board_HDI Board Proofing

2020-07-25

Multilayer circuit board factory: How to distinguish the number of layers of multilayer circuit board

The multi-layer circuit board factoryThe substrate is made of materials that are insulated and heat-resistant, and are not easy to bend. The small circuit material that can be seen on the surface is copper foil. The copper foil was originally covered on the entire circuit board, but part of it was etched away during the manufacturing process, and the remaining part became a net-like small circuit. NS. Multilayer circuit board factories call these lines as wires or wiring, and they are used to provide circuit connections for parts on the circuit board. _Blind Buried Via Circuit Board_Multilayer Circuit Board

2020-07-22

Multilayer circuit board factory: causes and solutions for layered blistering of multilayer circuit boards

In the pattern electroplating process of the multi-layer circuit board factory, because the circuit pattern is prone to side corrosion during the etching process, the tin-lead alloy plating part is suspended and the suspension layer is generated, which is easy to fall off, causing the bridge between the wires to cause a short circuit. . The multi-layer circuit board factory adopts the infrared hot-melt process method, which can make the exposed copper surface obtain extremely good protection. However, when used for infrared heat fusion of multilayer circuit boards, due to the high temperature, the delamination and blistering between layers of the multilayer circuit board is very serious, resulting in extremely low yield of the multilayer circuit board. _Blind Buried Via Circuit Board_Multilayer Circuit Board

2020-07-19

Multilayer circuit board factory: matters needing attention in the layout design of multilayer circuit board

The precautions that multi-layer circuit board manufacturers need to follow in the process of multi-layer circuit board wiring design are as follows: (1) The principle of setting the spacing of printed wiring of components in the multi-layer circuit board factory. The spacing constraints between different networks are determined by factors such as electrical insulation, manufacturing process, and the size of the spacing between printed traces of components. At the same time, setting the spacing also takes into account the production capacity of the multilayer circuit board factory.

2020-07-16

Multilayer circuit board factory: the general principle of multilayer circuit board stacking arrangement

Before a multi-layer circuit board factory designs a multi-layer circuit board, it must determine the structure of the multi-layer circuit board to be used according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use 4-layer, 6-layer or higher multilayer circuit boards. Once the number of layers is determined, the multi-layer circuit board factory has decided to determine the placement of the electrical layers in the multi-layer circuit board and how to distribute different signals on these layers. This is the question of the choice of laminated structure for multilayer circuit board factories.

2020-07-13

Multi-layer circuit board-considerations for multi-layer circuit board design

Nowadays, electronic technology is more and more developed. Products such as routers, mobile phones, switches, and base stations are all high-speed signals, which are susceptible to interference and crosstalk. In order to ensure the integrity of high-speed signals, a reasonable design of multi-layer circuit boards can effectively improve the integrity of the signal and reduce the level of signal interference to an extremely low level.

2020-07-11

Multilayer circuit board factory: design steps of multilayer circuit board

The design process of multi-layer circuit boards is basically the same as that of conventional PCB boards. The difference lies in the need to segment the intermediate signal layer and the internal electrical layer. On the whole, the design of multi-layer circuit boards is divided into the following stages: 1. The planning of multi-layer circuit boards is mainly to plan the physical size of the multi-layer circuit board, the package form of the components, the assembly method, and the layer structure of the circuit board. , Namely single-layer, double-layer and multi-layer boards.

2020-07-08

Multilayer circuit board factory: How to deal with the problem of multilayer circuit board lamination process

When a multilayer circuit board lamination process problem occurs, the first thing to consider is to integrate this problem into the process specifications of the multilayer circuit board, and gradually enrich our technical specifications. When a certain amount is reached, the quality will change. Most of the quality problems that occur in the lamination process of multi-layer circuit boards are generally caused by the supplier's raw materials or different lamination loads.

2020-07-01

Multilayer circuit board factory: precautions for multi-layer circuit board proofing

At present, various companies pay special attention to the quality of their products. In the manufacturing industry, the improvement of product quality also plays an important role in the reputation of the industry. Multilayer circuit boards have good quality in the circuit board manufacturing industry. Therefore, many related manufacturers of multilayer circuit boards will calibrate the multilayer circuit boards before production to verify whether the performance of the circuit design meets the requirements.

2020-06-28

Multilayer circuit board factory: advantages and applications of multilayer circuit boards

Multilayer circuit boards are an inevitable product of the high-speed, multi-function, large-capacity, and small-scale development of electronic technology. With the development of electronic technology, especially the widespread popularity of large-scale and very large-scale integrated circuits, multilayer printed circuits are rapidly developing in the direction of high-density, high-precision, and high-level digitalization. Technologies such as hole-buried hole and high plate thickness-to-aperture ratio can meet the needs of the market.

2020-06-22

Multilayer circuit board factory: Introduction to the production process of multilayer circuit board

Multilayer circuit board is a kind of printed circuit board, which is made by lamination and bonding of conductive pattern layer and insulator. The number of layers of the conductive pattern is more than 3, and the electrical interconnection between the layers is realized through metallized holes. The double panel is the inner layer, the two single panels are the outer layer, or the two double panels are the inner layer. If two single panels are used as the outer layer, they are combined with each other through the layout system and the insulating bonding material, and according to The design requires that the conductive patterns are connected together, which will become a 4-layer or 6-layer printed circuit board, also known as a multilayer PCB circuit board.

2018-10-30

5G concept fire PCB material group fever

Timing has entered the traditional peak season of the PCB group, and the start-up of pulling goods has driven manufacturers' performance to rise. The legal person said that the benefits of 5G communication technology are gradually showing, whether it is still under development, proofing, certification, or related high-frequency materials have been shipped one after another. In order to take the lead, all major factories are actively deploying. Among them, CCL (copper foil substrate) is an important material for PCB. With the improvement of process technology, relevant CCL manufacturers will be the first beneficiaries. Taiyao has been actively developing high-frequency and high-speed products in recent years, including Netcom, servers, base stations, etc. A few days ago, foreign investment reports even pointed out that it is optimistic that the era of high Internet speed will drive the demand for CCL to increase sharply.

2018-07-20

The Sino-U.S. trade war is intensifying, and it is not easy to resolve in the short term

The Sino-U.S. trade war has intensified. Although the Sichuan-Xiwei hotline is expected to take place at the G20 summit in the near future, there are deep trade differences between the two sides and it is not easy to resolve them in the short term. Next year, focusing on the 5G infrastructure construction of telecommunications companies in various countries is a relatively safe investment direction in this uncertain era. Among them, in the 5G base station construction business opportunity, PCB (printed circuit board) specifications will be greatly improved, and those who can develop high-specification PCBs will benefit. Observing the development schedule of 5G spectrum in various countries, South Korea, Japan, China, and Europe will release the frequency band between 3GHz and 6GHz in the first half of 2019, which is the highest compared to 4G.

2018-12-12

With the continuous advancement of technology, the quality control of the internal PCB circuit boards is becoming more and more stringent.

With the continuous advancement of science and technology, the continuous improvement of people's living standards, the continuous development of smart phone technology and wearable electronic technology, intelligence, thinness, and miniaturization have become the mainstream, and consumers will have higher and higher product quality requirements. Therefore, as a laser marking machine manufacturer, the quality control of the internal PCB circuit board is becoming more and more stringent. It must be better to win consumers, win the recognition of customers, and achieve secondary purchases, such as Apple, Huawei, etc. Technology leader. PCB is one of the important components of the electronics industry. The industrial output value accounts for about a quarter of the total output value of electronic components.

2019-01-09

Technology Sharing: Steps for PCB Recycling

Any item will be damaged if it is continuously used, especially electronic products. However, the damaged items are not completely waste and can be recycled, and the same is true for PCBs. Moreover, with the advancement of science and technology, the number of electronic products has increased sharply, shortening their use cycles, and many products are discarded without being damaged, leading to serious waste. Products in the electronics industry are updated very quickly, and the number of discarded PCBs generated therewith is also very staggering. Every year, there are more than 50,000 tons of discarded PCBs in the UK, and as many as 100,000 tons in Taiwan. Recycling is the principle of resource conservation and green production. Moreover, there are some

2019-02-06

Three special routing techniques for PCB: right-angle routing, differential routing, serpentine routing

Layout is one of the most basic work skills of pcb design engineers. The quality of the wiring will directly affect the performance of the entire system. Most high-speed design theories must be finally implemented and verified through Layout. It can be seen that wiring is very important in high-speed PCB design. The following will analyze the rationality of some situations that may be encountered in actual wiring, and give some more optimized routing strategies. It is mainly explained from three aspects: right-angle wiring, differential wiring, and serpentine wiring. 1. Right-angle routing: Right-angle routing is generally a requirement to avoid as much as possible in PCB wiring.