The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
The multilayer wiring board is a printed circuit board made by laminating a conductive pattern layer and an insulator. The number of layers of the conductive pattern is more than 3, and the interlayer electrical interconnection is realized through the metallized hole. The double panel is the inner layer, and the two single panels are the outer layers, or the two double panels are the inner layers. If two single panels are used as the outer layers, they are combined with each other through the layout system and the insulating bonding material, and The conductive patterns are connected together according to the design requirements, and will become a 4-layer, 6-layer printed circuit board, also known as a multilayer PCB circuit board.
What is the process flow of thick copper circuit boards, even some new counterparts in the industry are confused. When inquiring, customers often say that the circuit board is very simple, and you can tell the price. In fact, the processing process of the thick copper circuit board depends on the number of layers, the number of vias, the line width and the line distance of the thick copper circuit board. Some large companies need two days to review the thick copper circuit board documents. For example, the combination of hardware and software boards, the requirements for the machine, and the company's management level are inseparable. Whether it is simple or complex, let's talk about the production process of thick copper circuit boards:
Thick copper wiring boards are formed by laminating and bonding several etched single-sided or double-sided boards. Compared with single-layer and double-layer circuit boards, what are the characteristics of thick copper circuit boards?
At present, the recycling and treatment methods of waste circuit boards generally use direct burial method, incineration method, water washing method and cracking method, but they will release toxic substances and easily cause serious secondary pollution to the air or soil and other environments. This is the national environment. The protection policy does not allow. The way to promote the recycling of thick copper circuit boards is to use thick copper circuit board recycling equipment and circuit board recycling resource utilization equipment. These circuit board separation and recycling are suitable for the recycling of electronic waste such as various circuit boards, circuit boards and FPC flexible circuit boards. It has the advantages of low environmental pollution, high comprehensive utilization rate and high added value.
PCBs tend to be crowded, and it is difficult to connect the required components to both sides of the board. Generally, the preferred method of obtaining the required space using blind vias and buried vias is to secure all the appropriate components to the PCB board. Of course, many people are not entirely sure what blind buried circuit boards and buried vias are or how to use them. It is important to understand what they are and how they can help.
A topic that often arises when discussing PCB manufacturing is blind-buried circuit boards and buried holes. Here, we will discuss what these are and how they can help you get a PCB that meets your intended functionality. We will review the benefits of blind-buried circuit boards and buried vias, their structure, and why it is important to cooperate with experienced PCB manufacturers who know how to correctly add blind-buried circuit boards and buried vias to printed circuit boards.