Before a multi-layer circuit board factory designs a multi-layer circuit board, it must determine the structure of the multi-layer circuit board to be used according to the circuit scale, the size of the circuit board and the electromagnetic compatibility (EMC) requirements. That is to decide whether to use 4-layer, 6-layer or higher multilayer circuit boards. Once the number of layers is determined, the multi-layer circuit board factory has decided to determine the placement of the electrical layers in the multi-layer circuit board and how to distribute different signals on these layers. This is the question of the choice of laminated structure for multilayer circuit board factories.

The general principle of multilayer circuit board stacking arrangement adopted by the multilayer circuit board factory:

1) Below the device surface (the second layer) is the ground plane, which provides a device shielding layer and a reference plane for device surface wiring;

2) All signal layers of multilayer circuit boards are as close as possible to the ground plane;

3) Try to avoid two signal layers directly adjacent to each other;

4) The main power supply is as close as possible to the corresponding place;

5) In principle, a multi-layer circuit board factory should adopt a symmetrical structure design. The meaning of symmetry includes: the thickness and type of the dielectric layer, the thickness of the copper foil, and the pattern

6) Symmetry of distribution type of multilayer circuit board (large copper foil layer, circuit layer).

Multi-layer circuit board factories should flexibly grasp the above principles when setting up the layers of specific multilayer circuit boards. On the basis of understanding the above principles, according to the actual needs of the single board, such as: whether a key wiring layer and power supply are required , The division of the ground plane, etc., determine the arrangement of the layers, and do not copy it mechanically.