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Multilayer circuit board factory: the general principle of multilayer circuit board stacking arrangement

Multilayer circuit board factory: the general principle of multilayer circuit board stacking arrangement

  • Categories:Industry News
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  • Time of issue:2020-07-16 14:34
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Multilayer circuit board factory: the general principle of multilayer circuit board stacking arrangement

Information

Before a multi-layer circuit board factory designs a multi-layer circuit board, it must determine the structure of the multi-layer circuit board to be used according to the circuit scale, the size of the circuit board and the electromagnetic compatibility (EMC) requirements. That is to decide whether to use 4-layer, 6-layer or higher multilayer circuit boards. Once the number of layers is determined, the multi-layer circuit board factory has decided to determine the placement of the electrical layers in the multi-layer circuit board and how to distribute different signals on these layers. This is the question of the choice of laminated structure for multilayer circuit board factories.

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The general principle of multilayer circuit board stacking arrangement adopted by the multilayer circuit board factory:

1) Below the device surface (the second layer) is the ground plane, which provides a device shielding layer and a reference plane for device surface wiring;

2) All signal layers of multilayer circuit boards are as close as possible to the ground plane;

3) Try to avoid two signal layers directly adjacent to each other;

4) The main power supply is as close as possible to the corresponding place;

5) In principle, a multi-layer circuit board factory should adopt a symmetrical structure design. The meaning of symmetry includes: the thickness and type of the dielectric layer, the thickness of the copper foil, and the pattern

6) Symmetry of distribution type of multilayer circuit board (large copper foil layer, circuit layer).

 

Multi-layer circuit board factories should flexibly grasp the above principles when setting up the layers of specific multilayer circuit boards. On the basis of understanding the above principles, according to the actual needs of the single board, such as: whether a key wiring layer and power supply are required , The division of the ground plane, etc., determine the arrangement of the layers, and do not copy it mechanically.

Keyword:

The evaluation system of the circuit board factory should follow the following principles

The evaluation system of the circuit board factory should follow the following principles

Establishing a good cooperative relationship with circuit board factories is conducive to cost reduction, response time reduction and the creation of new market value, etc. The core issue is how to choose the ideal circuit board factory. There are many factors involved in the evaluation of circuit board factories, and the evaluation index systems are diverse, both qualitative and quantitative, and the index weights are also different. Therefore, it is necessary to establish a universal and expandable evaluation index system for circuit board factories. , And the indicator system should follow the following principles:
The use of soft and hard circuit boards?

The use of soft and hard circuit boards?

In our daily life, circuit boards are mostly single-sided, double-sided, or multi-layer boards, rigid boards, metal-based circuit boards, aluminum, copper substrates, thermally conductive fiberboards, etc., do you know what a flexible and rigid circuit board is? Rigid-flex circuit board: refers to a special circuit board made by pressing a rigid circuit board (PCB) and a flexible circuit board (FPC). The main board materials used are rigid board FR4 and flexible board polyimide (PI). Rigid and flexible circuit boards combine the rigid characteristics of rigid circuit boards and the advantages of flexible circuit
Soft and hard circuit board production process

Soft and hard circuit board production process

The flexible and hard circuit board is the flexible circuit board and the rigid circuit board. After pressing and other processes, they are combined according to the relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. In the past, two hard boards were connected by using soft boards and connectors to connect each other. In order to improve the reliability of the connection between the rigid board and the flexible board, the flexible board is directly fabricated between two rigid boards in the printed circuit board (PCB) factory, which can avoid the subsequent connection process, whether it is a rigid board manufacturer or FPC manufacturers are now able to supply rigid-flex boards. Under the demand for light and thin end products, the

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