The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
Circuit Board Factory Talk about Application Advantage Analysis of FPC in Wearable Devices
Circuit Board Factory: Application Advantage Analysis of FPC in Wearable Devices
Circuit Board Factory Xiaobian talked about FPC with excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Circuit Board Factory: Advantages of 1. FPC Flexible Circuit Board
With the 5G substitution trend and the growth of the smart wearable device market, FPC flexible circuit board has become the main application component in electronic products with its advantages of high speed, high frequency, bending, folding, light and thin integration, etc. The physical characteristics of FPC can be summarized as follows: in compact and light-weight products, multi-dimensional packaging can be realized to improve product flexibility and space utilization; excellent electrical performance, fast electrical signal transmission, and higher assembly reliability; help Reduce the assembly process of electronic products and improve mechanical stability.
Circuit board factory: 2. FPC flexible circuit board application in smart phones
FPC can be used in smart phones, such as cameras, displays, touch screens, batteries, antennas, fingerprint modules, buttons and other hardware. With the advent of 5G, the use of FPC flexible circuit boards is also increasing, mainly reflected in the application of multi-camera, under-screen fingerprint module, RF antenna, folding screen, flexible screen and its scalability. The number of FPC flexible circuit boards used in a single smartphone can be increased to about 20 pairs.
Flexible Printed Circuit Board (FPC) has great advantages in folding screen mobile phones, which can be bent hundreds of times to meet the development needs of folding screen mobile phones. The volume is light and thin, which is beneficial to reduce the thickness of the folding screen mobile phone.
Circuit Board Factory: Application of 3. FPC flexible circuit boards in smart wearable devices
In smart wearable devices, the smart watch and TWS headset markets have grown significantly and have broad prospects. FPC is one of the main materials for smart wearable devices. It has high stability and reliable connection in a miniaturized space, which can reduce the number of electronic packages and the probability of electronic failure. FPC has the advantages of thin thickness, light weight, and good flexibility. It can also adapt to various forms of smart wearable devices, and has a large space for development in this field.
circuit board factory: 4. high-quality FPC flexible circuit boards meet the conditions
Due to different manufacturing processes or material choices, the performance and quality of FPC boards are very different. High-quality FPC boards should meet these requirements:
1. No deformation in appearance, good screw hole position, no design error;
2. It has strong environmental resistance, it can maintain good performance in high temperature and high humidity environment;
3. The thickness, width and distance of the circuit meet the installation requirements, and there is no short circuit or open circuit
;4. There is no additional electromagnetic radiation, and the copper on the surface is not easy to fall off and oxidize;
5. Mechanical, electrical and environmental performance meet the test requirements and have high reliability.
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The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
2023-07-28
The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
2023-07-28
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
2023-07-28
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
2023-07-28
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
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