12-layer board multilayer circuit board multilayer circuit board multilayer printed circuit board
Number of layers: 12 layers plate thickness: 1.6MM minimum line width line spacing: 3MIL/4MIL minimum through hole: 0.2MM hole to line distance: 7MIL surface treatment: communication equipment in gold sinking applications
Layer Number: 12 Layer Board
Plate Thickness: 1. 6MM
Minimum Line Width Line Distance: 3MIL/4MIL
Minimum Through Hole: 0. 2MM
Hole to Line Distance: 7MIL
Surface Treatment: Shen Jin
Application Field: communication equipment
12-layer board, as a kind of multilayer board, also has the advantages of multilayer board:
1. High assembly density and small volume;
2. The connection between electronic components is shortened and the signal transmission speed is improved;
3. Convenient wiring;
4. For high-frequency circuits, add a ground layer to make the signal line form a constant low impedance to the ground;
5. Good shielding effect.
16-layer board is also relatively insufficient, such as: many layers, high cost, longer processing cycle, quality inspection is more troublesome.
Shenzhen Hengke Sheng Electronics Co., Ltd. is a new high-tech enterprises. As a professional multi-layer circuit board factory, the main products are multi-layer circuit board, HDI board proofing, HDI circuit board, blind buried hole circuit board, soft and hard combination circuit board, pcb circuit board proofing, ceramic circuit board, high density connection board, multi-layer printed circuit board, etc. Specially for domestic and foreign high-tech enterprises and scientific research units to provide superior fast service. Hengkesheng Electronics has been selected as the annual outstanding supplier of many well-known enterprises at home and abroad. It is a private technology enterprise recognized by the Shenzhen Municipal Science and Technology Bureau. At the same time, the company has worked together in the development process and is committed to creating excellent culture and excellent enterprises. Adhere to the spirit of perseverance, and constantly absorb international emerging technologies. Improve product quality and exceed customer needs.