Company Profile

Shenzhen Hengke Sheng Electronics Co., Ltd. was established in 2001, with a total investment of US $0.15 billion, covering an area of 100000 square meters and a plant area of 90000 square meters. In Shenzhen, Qingyuan has two modern factories. The company is a new high-tech enterprise, the company's main: blind buried hole circuit board, thick copper circuit board, HDI circuit board, pcb and other products, is a professional pcb factory, circuit board factory, circuit board factory, multilayer circuit board factory, Shenzhen circuit board factory, multilayer circuit board factory. The company's annual output of more than 900000 square meters, enterprises through the ISO9001, products are through UL, QS9000, ROHS certification. Specially for domestic and foreign high-tech enterprises and scientific research units to provide superior fast service. Products are mainly used in communication equipment, computers, detection and control systems, aviation and military equipment and other fields.

Products

6 layer board pcb circuit board proofing PCB circuit board factory circuit board factory

Number of layers: 6 layers plate thickness: 1.0MM minimum line width line distance: 4MIL/3MIL minimum through hole: 0.2MM hole to line distance: 6.5MIL surface treatment: gold sinking application field: industrial control

Ultra-thick Board Blind Buried Hole Circuit Board HDI Circuit Board HDI Board Proofing

Number of layers: 4-layer plate thickness: 5.0MM minimum line width line spacing: 5MIL/5MIL minimum through hole: 1.0MM surface treatment: wind power equipment in gold sinking applications

thick copper circuit board

Features of thick copper circuit boards: 1. Thick copper circuit boards have high assembly density and small size. The thick copper circuit board is convenient for wiring, shortens the wiring length and the wiring between components, and helps to improve the signal transmission speed. 3. For high-frequency circuits, after adding a ground layer, the signal line and the ground layer form a constant low impedance, the circuit impedance is greatly reduced, and the shielding effect is good. 4. For electronic products with high heat dissipation requirements, thick copper circuit boards can be equipped with a metal core heat dissipation layer to meet the needs of special functions such as shielding and heat dissipation. 5. In terms of performance, thick copper circuit boards are better than single-sided and double-sided circuit boards, but the higher the number of layers, the higher the manufacturing cost, the longer the processing time, and the more complicated the quality inspection. 6. Four-layer or six-layer boards are common in thick copper circuit boards. The difference between the four-layer board and the six-layer board is that there are two internal signal layers between the middle layer, the ground layer and the power layer. The six-layer board is thicker than the four-layer board.

4-layer multilayer circuit board multilayer circuit board factory circuit board factory

Number of layers: 4 layers of plate thickness: 1.0MM minimum line width line spacing: 3MIL/3MIL minimum through hole: 0.2MM surface treatment: gold sinking application: automotive electronics

8-layer board multilayer circuit board multilayer printed circuit board circuit board factory

Number of layers: 8 layers plate thickness: 1.2MM minimum line width line distance: 3MIL/4MIL minimum through hole: 0.2MM hole to line distance: 7MIL surface treatment: gold sinking application field: automotive electronics

16-layer multilayer circuit board multilayer circuit board factory multilayer circuit board

Number of layers: 16 layers plate thickness: 2.0MM minimum line width line spacing: 4MIL/4MIL minimum through hole: 0.25MM surface treatment: security equipment for gold sinking applications

12-layer board multilayer circuit board multilayer circuit board multilayer printed circuit board

Number of layers: 12 layers plate thickness: 1.6MM minimum line width line spacing: 3MIL/4MIL minimum through hole: 0.2MM hole to line distance: 7MIL surface treatment: communication equipment in gold sinking applications

10-layer board multi-layer circuit board soft and hard combination circuit board multi-layer circuit board.

Number of layers: 10 layers of plate thickness: 1.6MM minimum line width line spacing: 3MIL/4MIL minimum through hole: 0.2MM surface treatment: gold deposition application: medical instruments

News

The circuit board factory talks about the application advantage analysis of FPC in wearable devices.

2022-04-14 10:22

The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.

Multi-layer circuit board factory-multi-layer circuit board compatible design points description.

2020-07-28 13:50

Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing

Multi-layer circuit board factory: reasons and solutions for layered blistering of multi-layer circuit boards

2020-07-22 17:06

In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board

Multi-layer circuit board factory: general principles of multi-layer circuit board stacking arrangement

2020-07-16 14:34

Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.

Multi-layer circuit board factory: multi-layer circuit board production process introduction

2020-06-22 13:10

The multilayer wiring board is a printed circuit board made by laminating a conductive pattern layer and an insulator. The number of layers of the conductive pattern is more than 3, and the interlayer electrical interconnection is realized through the metallized hole. The double panel is the inner layer, and the two single panels are the outer layers, or the two double panels are the inner layers. If two single panels are used as the outer layers, they are combined with each other through the layout system and the insulating bonding material, and The conductive patterns are connected together according to the design requirements, and will become a 4-layer, 6-layer printed circuit board, also known as a multilayer PCB circuit board.

What is the process flow of thick copper circuit board

2021-12-20 16:05

What is the process flow of thick copper circuit boards, even some new counterparts in the industry are confused. When inquiring, customers often say that the circuit board is very simple, and you can tell the price. In fact, the processing process of the thick copper circuit board depends on the number of layers, the number of vias, the line width and the line distance of the thick copper circuit board. Some large companies need two days to review the thick copper circuit board documents. For example, the combination of hardware and software boards, the requirements for the machine, and the company's management level are inseparable. Whether it is simple or complex, let's talk about the production process of thick copper circuit boards:

What are the characteristics of thick copper circuit boards?

2022-01-17 14:35

Thick copper wiring boards are formed by laminating and bonding several etched single-sided or double-sided boards. Compared with single-layer and double-layer circuit boards, what are the characteristics of thick copper circuit boards?

Thick Copper Circuit Board Recycling Equipment Circuit Board Recycling and Resource Utilization

2022-02-16 13:29

At present, the recycling and treatment methods of waste circuit boards generally use direct burial method, incineration method, water washing method and cracking method, but they will release toxic substances and easily cause serious secondary pollution to the air or soil and other environments. This is the national environment. The protection policy does not allow. The way to promote the recycling of thick copper circuit boards is to use thick copper circuit board recycling equipment and circuit board recycling resource utilization equipment. These circuit board separation and recycling are suitable for the recycling of electronic waste such as various circuit boards, circuit boards and FPC flexible circuit boards. It has the advantages of low environmental pollution, high comprehensive utilization rate and high added value.

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National Service Hotline:

86-755-29615096

Shenzhen Hengke Sheng Electronics Co.

Fax: 86-755-27691537

Mailbox: csaa@hengkepcb.com

Website: www.hengkepcb.com

Address: No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province

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