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Multilayer Board

6-layer PCB PCB circuit board proofing PCB circuit board factory Circuit board factory

Number of floors: 6 floors Board thickness: 1.0MM Minimum line width and distance: 4MIL/3MIL Minimum through hole: 0.2MM Distance from hole to line: 6.5MIL Surface treatment: Immersion gold Application field: industrial control

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Multilayer Board

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Parameters

Product parameters:

Number of floors: 6 floors
Board thickness: 1.0MM
Minimum line width and distance: 4MIL/3MIL
Minimum through hole: 0.2MM
Distance from hole to line: 6.5MIL
Surface treatment: Immersion gold

Application field: industrial control

The common 6-layer board stacking design schemes mainly include the following three:

6-layer laminate design scheme 1:

Stacked design: TOP, GND02, S03, PWR04, GND05, BOTTOM

This scheme is the main selection layer setting scheme of the current six-layer PCB in the industry, with 3 wiring layers and 3 reference planes. The thickness of the core board between layer 4 and layer 5 should not be too thick in order to obtain lower transmission line impedance. Low impedance characteristics can improve the decoupling effect of the power supply. The third layer is the optimal wiring layer. High-risk lines must be laid on this layer to ensure signal integrity and resist EM energy. The bottom layer is the next best wiring layer. The top layer is the routable layer.

6-layer board stacking design plan 2:

Stacked design: TOP, GND02, S03, S04, PWR05, BOTTOM

When there are too many wires on the circuit board and the three wiring layers cannot be arranged, this stacking scheme can be used. This solution has 4 wiring layers and two reference planes, but there are two signal layers sandwiched between the power plane and the ground plane, and there is no power decoupling effect between the power plane and the ground plane. Since layer 3 is close to the ground plane, it is the best wiring layer and high-risk lines should be arranged. The first layer, the fourth layer, and the sixth layer are layers that can be routed.

6-layer laminate design scheme three:

Stacked design: TOP, S02, GND03, PWR04, S05, BOTTOM

This scheme also has 4 wiring layers and two reference planes. The power plane/ground plane of this structure adopts a structure with a small spacing, which can provide lower power supply impedance and better power decoupling. The top and bottom layers are poor wiring layers. The second layer close to the ground plane is the best wiring layer and can be used to route high-risk signal lines. Under the condition of ensuring the RF return path, the fifth layer can also be used as a wiring layer for other high-risk wiring. The first and second layers, the fifth and the sixth layers should use cross wiring.

Keyword:

layer

wiring

layers

plane

power