6 layer board pcb circuit board proofing PCB circuit board factory circuit board factory
Number of layers: 6 layers plate thickness: 1.0MM minimum line width line distance: 4MIL/3MIL minimum through hole: 0.2MM hole to line distance: 6.5MIL surface treatment: gold sinking application field: industrial control
Classification:
Key words:
Share:
Commodity Description
product parameters:
layers: 6 layers
plate thickness: 1. 0MM
minimum line width line spacing: 4MIL/3MIL
minimum through hole: 0. 2MM
hole to line distance: 6.5MIL
surface treatment: gold deposition
application field: industrial control
common 6-layer plate lamination design schemes are mainly as follows:
6-layer laminate design scheme 1:
laminate design: TOP, GND02, S03, PWR04, GND05, BOTTOM
This scheme is the main layer setting scheme of the current six-layer PCB in the industry, with 3 wiring layers and 3 reference planes. The thickness of the core between the fourth and fifth layers should not be too thick in order to obtain a lower transmission line impedance. The low impedance characteristic may improve the decoupling effect of the power supply. Layer 3 is the optimal wiring layer, and high-risk lines must be laid on this layer to ensure signal integrity and resist EM energy. The bottom layer is the next best wiring layer. The top layer is the routable layer.
6-layer laminate design scheme 2:
laminate design: TOP, GND02, S03, S04, PWR05, BOTTOM
when there are too many wires on the circuit board and the three wiring layers cannot be arranged, this laminate scheme can be adopted. This scheme has four wiring layers and two reference planes, but there are two signal layers between the power plane and the ground plane, and there is no power decoupling between the power plane and the ground plane. Since layer 3 is close to the ground plane, it is the best wiring layer and high-risk lines should be arranged. The first layer, the fourth layer, and the sixth layer are wiring possible layers.
6-layer laminate design scheme 3:
laminate design: TOP, S02, GND03, PWR04, S05, BOTTOM
this scheme also has 4 wiring layers and 2 reference planes. The power plane/ground plane of this structure adopts a small pitch structure, which can provide a lower power impedance and a better power decoupling effect. The top and bottom layers are poor wiring layers. The second layer near the ground plane is the best routing layer and can be used to route high-risk signal lines. The fifth layer may be used as a wiring layer for other high-risk wirings under the condition that an RF return path is secured. Crossover wiring shall be used for layers 1 and 2, and layers 5 and 6.
Previous Page
Next Page
Previous Page
Next Page
Related Products
Message inquiry
National Service Hotline:
Shenzhen Hengke Sheng Electronics Co.
-
Fax: 86-755-27691537
Mailbox: csaa@hengkepcb.com
Website: www.hengkepcb.com
Address: No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province
Copyright: Shenzhen Hengke Sheng Electronics Co., Ltd
Website Construction: China Enterprise Power Longgang