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Ultra-thick Board Blind Buried Hole Circuit Board HDI Circuit Board HDI Board Proofing

Number of layers: 4-layer plate thickness: 5.0MM minimum line width line spacing: 5MIL/5MIL minimum through hole: 1.0MM surface treatment: wind power equipment in gold sinking applications

8-layer board multilayer circuit board multilayer printed circuit board circuit board factory

Number of layers: 8 layers plate thickness: 1.2MM minimum line width line distance: 3MIL/4MIL minimum through hole: 0.2MM hole to line distance: 7MIL surface treatment: gold sinking application field: automotive electronics

16-layer multilayer circuit board multilayer circuit board factory multilayer circuit board

Number of layers: 16 layers plate thickness: 2.0MM minimum line width line spacing: 4MIL/4MIL minimum through hole: 0.25MM surface treatment: security equipment for gold sinking applications

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