Thick Copper Circuit Board Recycling Equipment Circuit Board Recycling and Resource Utilization
thick copper circuit board is composed of base material, base copper, plating layer and surface protective paint. The substrate is composed of synthetic resin and glass fiber. Waste circuit boards are copper foil, copper plating, and then plated with nickel, gold, silver or tin. The circuit board contains copper, gold, silver, palladium, platinum and other precious metals. These discarded circuit boards can usually recover 80%-90% of the precious metals, and realize the resource utilization of the circuit board through some treatment methods. Thick copper circuit board is the core of the whole electronic waste, and it is also a difficult component to deal.
If you encounter a kind of waste circuit board recycling equipment that can realize resource utilization, will you choose to try it out?
A set of thick copper circuit board recycling equipment production line to realize the innovative development of energy saving and environmental protection of circuit board recycling equipment. The
thick copper circuit board process does not need to disassemble the circuit board, circuit board and other raw materials containing electrical components, and can directly enter the production line for processing and production. The material is separated and recovered by the processes of initial coarse crushing, magnetic separation, medium and fine crushing, dust removal, air separation, vibration screening, specific gravity separator, electric separation, etc., and the recovery rate can reach more than 99%. The whole process from feeding to sorting is automated, and only 1-2 people are required to operate. The process is a physical dry separation without heating, incineration, water and chemical raw materials. It has the advantages of low cost, high efficiency and no pollution. The
thick copper circuit board is disassembled into electronic components by the disassembling machine, and the resin powder and copper are separated by the separator. The electronic component may extract precious metals, gold, silver, palladium, platinum, or the like using a precious metal extraction apparatus. The value of crushing, separating and recycling waste circuit boards is self-evident!
If we do not eliminate the bubbles in the green ink in time, what harm will it bring?
1. Green oil foaming will cause the size of the nail on the circuit board to blister, affecting the appearance of the circuit board;
2. Too much foam will slow down the PCB production schedule, reduce PCB production efficiency, and generate unnecessary production costs.
3. Foam will cause the delamination of the solder mask and the positive substrate, which will affect the performance of the PCB and cause quality problems.
4. A large number of bubbles will overflow the green ink production system, which will not only pollute the surrounding environment, but also cause waste of green ink.
Facing the problem of green ink foaming, the printed circuit board defoamer can quickly remove the foam after adding the green ink, and there is no foaming in the subsequent production operation. Chemically stable. Add to the green ink will not affect the basic performance of green ink, will not change its appearance and color; high temperature resistance, acid and alkali resistance, in these environments can play a stable anti-foaming performance.
thick copper circuit board
The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
2023-07-28
The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
2023-07-28
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
2023-07-28
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
2023-07-28
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
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