What are the advantages of blind buried circuit board?
Discussion A topic that often arises during PCB manufacturing is blind-buried wiring boards and buried vias. Here, we will discuss what these are and how they can help you get a PCB that meets your intended functionality. We will review the benefits of blind buried circuit boards and buried vias, their structure, and why it is important to cooperate with experienced PCB manufacturers who know how to correctly add blind buried circuit boards and buried vias to printed circuit boards. Important.
It is usually difficult to install all the connections required on PCB to a single layer. The solution to this problem is to use vias. They are conductive vias shaped like buckets that allow multi-layer connections on PCB . Although there are multiple vias, two are commonly used. These are blind buried via boards and buried vias, which we believe can bring some benefits to people who use vias in PCB .
General design uses the advantages of blind buried hole circuit boards and buried holes: In non-through hole technology, the application of blind buried hole circuit boards and buried holes can greatly reduce hdi multilayer PCB The size and quality of the board reduce the number of layers and increase electromagnetic compatibility. It also reduces costs, and it also needs to make the default office simpler, more convenient, and more agile. In the conventional PCB pre-set and processing, through holes can cause many problems. They take up a lot of useful space, and the densely distributed vias in one place also cause a lot of stumbling blocks to the inner layer wiring of the multi-layer PCB . These vias occupy the space required for wiring and are densely distributed. The current through the source surface and the ground layer will also destroy the special characteristics of the power ground layer impedance, so that the power ground layer failure. Common sense mechanical drilling will be 20 times more work than using non-penetrating hole technology. In the PCB design, although the size of the pads and vias has been gradually reduced, if the board layer thickness is not reduced proportionally, the aspect ratio of the through hole will increase, and the increase in the aspect ratio of the through hole will reduce Reliability. With the maturity of advanced laser drilling technology and plasma dry etching technology, the application of non-penetrating small blind buried hole circuit boards and small buried holes becomes possible. If the diameter of these non-penetrating holes is 0.3mm , the parasitic parameters generated are about 1/10 of the original ordinary hole, increasing the reliability of PCB . Proper use of non-through hole technology can reduce the large holes on PCB , leaving more space for traces. The remaining space can be used for large plane or object surface size shielding to improve EMI/RFI performance. At the same time, more remaining space can also be used to partially shield the inner layer components and key network cables, so that they have better electrical performance. Using non-through via as appropriate makes it easier to fan out component pins, requiring high-density lead components (such as BGA package components) to be easy to route, reduce string length, and meet high-speed circuit timing requirements.
Although hdi blind buried hole pcb multilayer board is an inevitable trend of the development of the times, the design of blind buried hole circuit board also has some shortcomings: the main disadvantage is the production of hdi circuit board High cost, complex production and processing. It not only increases the cost, but also has various potential risks in the quality process. Of course, not all electronic products need to be designed with a circuit board with a blind buried hole structure. Unless the package size of electronic products is limited, there is generally nothing you can do. In this case, HDI blind buried structure design will be used.
Blind buried hole circuit board
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In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
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Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
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