Application advantages of multilayer circuit boards
circuit boards are divided into three categories according to the number of layers: single-panel, double-panel and multi-layer circuit boards.
The first is a single panel. On a basic PCB, the parts are concentrated on one side and the wires are concentrated on the other side. Because the wires only appear on one side, this PCB is called a single-sided circuit board. Single panels are usually simple to manufacture and low in cost, but the disadvantage is that they cannot be applied to overly complex products.
Double panel is an extension of the single panel. When single-layer wiring cannot meet the needs of electronic products, double-sided boards should be used. There are copper-clad wires on both sides, and the wires between the two layers can be connected through vias to form the required network connection. The multi-layer board of
refers to a printed board having three or more conductive pattern layers laminated with an insulating material therebetween at intervals, and the conductive patterns therebetween are interconnected as required. multilayer circuit board is the product of the development of electronic information technology in the direction of high speed, multi-function, large capacity, small volume, thinner and lighter.
How to distinguish between multi-layer circuit boards and single-layer circuit boards:
1. Pick up the face light. The inner core is opaque to light is a multilayer board, on the contrary, it is a single and double-sided board. Single panel, only one layer of wiring, no copper inside the hole. There is a line on the front and back of the double-sided board, and there is copper in the via hole.
2. The production process of multi-layer circuit boards will be based on single-sided and double-sided boards with the production process of inner layer lamination. The use of slice distraction can also be analyzed.
Application advantages of multi-layer circuit boards:
1. High assembly density, small size and light weight, meeting the needs of lightweight and miniaturization of electronic equipment;
2. Due to the high assembly density, the wiring between components (including components) is reduced, the installation is simple, and the reliability is high;
3. Due to the repeatability and consistency of graphics, errors in wiring and assembly are reduced, save equipment maintenance, debugging and inspection time;
4, can increase the number of wiring layers, thus increasing design flexibility;
5, can form a circuit with a certain impedance, can form a high-speed transmission circuit;
6, can be set up circuit, magnetic circuit shielding layer, can also be set up metal core heat dissipation layer, to meet the needs of shielding, heat dissipation and other special functions.
With the continuous development of electronic technology and the continuous improvement of electronic equipment requirements in computer, medical, aviation and other industries, circuit boards are developing in the direction of reducing volume, reducing quality, and increasing density. Due to the limitation of available space, it has been impossible to achieve a further increase in the assembly density of single-sided printed boards. Therefore, it is necessary to consider the use of multi-layer circuit boards with more layers and higher packing density. Multilayer circuit boards have been widely used in the manufacture of electronic products due to their flexible design, stable and reliable electrical performance and superior economic performance.
Multi-layer circuit board, multi-layer circuit board, blind buried hole circuit board, thick copper circuit board, HDI board proofing, circuit board factory, circuit board factory, hard and soft combination circuit board, multi-layer circuit board factory, HDI circuit board
The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
2023-07-28
The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
2023-07-28
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
2023-07-28
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
2023-07-28
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
National Service Hotline:
Shenzhen Hengke Sheng Electronics Co.
-
Fax: 86-755-27691537
Mailbox: csaa@hengkepcb.com
Website: www.hengkepcb.com
Address: No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province
Copyright: Shenzhen Hengke Sheng Electronics Co., Ltd
Website Construction: China Enterprise Power Longgang