Difficulties in the manufacture of multilayer circuit boards
1, inter-layer alignment difficulties. Due to the large number of multi-layer circuit board layers, customers have more and more strict requirements on the alignment degree of PCB layers, and the alignment tolerance between layers is usually controlled at about 75 microns. Considering the large size design of high-level board units, the temperature and humidity of the environment in the graphics transfer workshop, the dislocation superposition caused by the inconsistency of the expansion and contraction of different core board layers, the control of the alignment degree between high-level boards is more difficult. 2. Difficulties in making inner circuit.
Multi-layer circuit board
is made of special materials such as high TG, high speed, high frequency, thick copper, thin dielectric layer, etc., which puts forward high requirements for the control of the inner circuit and graphics size. For example, the line width is small, the open short circuit is increased, and the qualified rate is low. There are many signal layers in the fine line, and the probability of missed detection of AOI in the inner layer is increased. The inner core plate is thin, easy to fold, resulting in poor exposure, easy to roll when etching through the machine, etc. 3, pressing production difficulties. The superposition of multiple inner core boards and prepreg is prone to defects such as skateboards, delamination, resin voids and residual bubbles. It is necessary to fully consider the heat resistance, voltage resistance, filling amount and medium thickness of the material, and set a reasonable high-rise plate pressing program. 4. Difficulties in drilling. The use of high TG, high speed, high frequency, thick copper special plates increases the difficulty of drilling roughness, drilling burrs and removing drilling dirt.
Shenzhen Hengke Sheng Electronics Co., Ltd. is a new high-tech enterprises. As a professional multi-layer circuit board factory, the main products are multi-layer circuit board,
HDI board proofing, HDI circuit board, blind buried hole circuit board, soft and hard combined circuit board, pcb circuit board proofing, ceramic circuit board, high density connection board, soft and hard combined board, FPC, multi-layer printed circuit board, etc. Specially for domestic and foreign high-tech enterprises and scientific research units to provide superior fast service. Hengkesheng Electronics has been selected as the annual outstanding supplier of many well-known enterprises at home and abroad. It is a private technology enterprise recognized by the Shenzhen Municipal Science and Technology Bureau. At the same time, the company has worked together in the development process and is committed to creating excellent culture and excellent enterprises. Adhere to the spirit of perseverance, and constantly absorb international emerging technologies. Improve product quality and exceed customer needs.
Multilayer Circuit Board, Multilayer Circuit Board
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