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Difficulties in manufacturing multi-layer circuit boards

Difficulties in manufacturing multi-layer circuit boards

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  • Time of issue:2021-06-03 14:39
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Difficulties in manufacturing multi-layer circuit boards

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Multi-layer circuit boards are generally defined as high-multilayer circuit boards with 10 to 20 layers or more, which are more difficult to process than traditional multi-layer circuit boards and require higher quality and reliability. Today I will share with you the manufacturing difficulties of multilayer circuit boards.

1. Difficulties in alignment between layers. Due to the large number of multi-layer circuit boards, customers have more and more stringent requirements for the alignment of the PCB layers. Usually the alignment tolerance between layers is controlled at about 75 microns; considering the larger design of the high-level board unit size and the graphics transfer workshop environment Temperature and humidity, as well as factors such as misalignment and stacking caused by inconsistency of expansion and contraction of different core layers, interlayer positioning methods, etc., make it more difficult to control the alignment of high-rise boards.

2. Difficulties in making inner circuit. Multilayer circuit boards are made of special materials such as high TG, high speed, high frequency, thick copper, thin dielectric layer, etc., which puts forward very high requirements for the control of the inner layer circuit and pattern size. For example, the line width is small, the open and short circuit increases, and the pass rate is low; there are more fine line signal layers, and the probability of missing AOI detection in the inner layer is increased; the inner core board is thin, which is easy to fold and cause poor exposure, and it is easy to roll the board when the machine is etched. .

3. Difficulties in pressing production. The superposition of multiple inner core boards and prepregs is prone to defects such as sliding plates, delamination, resin cavities and air bubbles. It is necessary to fully consider the heat resistance of the material, withstand voltage, the amount of glue and the thickness of the medium, and set a reasonable high-level board pressing program.

4. Difficulties in drilling drilling. The use of high-TG, high-speed, high-frequency, and thick copper special plates increases the difficulty of drilling roughness, drilling burrs and removing drilling dirt.

Shenzhen Hengkesheng Electronics Co., Ltd. is an emerging high-tech enterprise. As a professional multi-layer circuit board factory, its main products are multilayer circuit boards, HDI board proofing, HDI circuit boards, blind buried via circuit boards, rigid-flex circuit boards, PCB circuit board proofing, ceramic circuit boards, and high-density connection boards. , Rigid-flex board, FPC, multilayer printed circuit board, etc. Specially provide superior and fast service for domestic and foreign high-tech enterprises and scientific research units. Hengkesheng Electronics has been selected as the annual outstanding supplier of many well-known enterprises at home and abroad. It is a private technology enterprise recognized by the Shenzhen Municipal Science and Technology Bureau. At the same time, the company has worked together in the development process to create an excellent culture and an excellent enterprise. Adhere to the spirit of perseverance and continue to absorb emerging international technologies. Improve product quality and exceed customer needs.

Keyword:

The evaluation system of the circuit board factory should follow the following principles

The evaluation system of the circuit board factory should follow the following principles

Establishing a good cooperative relationship with circuit board factories is conducive to cost reduction, response time reduction and the creation of new market value, etc. The core issue is how to choose the ideal circuit board factory. There are many factors involved in the evaluation of circuit board factories, and the evaluation index systems are diverse, both qualitative and quantitative, and the index weights are also different. Therefore, it is necessary to establish a universal and expandable evaluation index system for circuit board factories. , And the indicator system should follow the following principles:
The use of soft and hard circuit boards?

The use of soft and hard circuit boards?

In our daily life, circuit boards are mostly single-sided, double-sided, or multi-layer boards, rigid boards, metal-based circuit boards, aluminum, copper substrates, thermally conductive fiberboards, etc., do you know what a flexible and rigid circuit board is? Rigid-flex circuit board: refers to a special circuit board made by pressing a rigid circuit board (PCB) and a flexible circuit board (FPC). The main board materials used are rigid board FR4 and flexible board polyimide (PI). Rigid and flexible circuit boards combine the rigid characteristics of rigid circuit boards and the advantages of flexible circuit
Soft and hard circuit board production process

Soft and hard circuit board production process

The flexible and hard circuit board is the flexible circuit board and the rigid circuit board. After pressing and other processes, they are combined according to the relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. In the past, two hard boards were connected by using soft boards and connectors to connect each other. In order to improve the reliability of the connection between the rigid board and the flexible board, the flexible board is directly fabricated between two rigid boards in the printed circuit board (PCB) factory, which can avoid the subsequent connection process, whether it is a rigid board manufacturer or FPC manufacturers are now able to supply rigid-flex boards. Under the demand for light and thin end products, the

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