Multi-layer circuit boards are generally defined as high-multilayer circuit boards with 10 to 20 layers or more, which are more difficult to process than traditional multi-layer circuit boards and require higher quality and reliability. Today I will share with you the manufacturing difficulties of multilayer circuit boards.

1. Difficulties in alignment between layers. Due to the large number of multi-layer circuit boards, customers have more and more stringent requirements for the alignment of the PCB layers. Usually the alignment tolerance between layers is controlled at about 75 microns; considering the larger design of the high-level board unit size and the graphics transfer workshop environment Temperature and humidity, as well as factors such as misalignment and stacking caused by inconsistency of expansion and contraction of different core layers, interlayer positioning methods, etc., make it more difficult to control the alignment of high-rise boards.

2. Difficulties in making inner circuit. Multilayer circuit boards are made of special materials such as high TG, high speed, high frequency, thick copper, thin dielectric layer, etc., which puts forward very high requirements for the control of the inner layer circuit and pattern size. For example, the line width is small, the open and short circuit increases, and the pass rate is low; there are more fine line signal layers, and the probability of missing AOI detection in the inner layer is increased; the inner core board is thin, which is easy to fold and cause poor exposure, and it is easy to roll the board when the machine is etched. .

3. Difficulties in pressing production. The superposition of multiple inner core boards and prepregs is prone to defects such as sliding plates, delamination, resin cavities and air bubbles. It is necessary to fully consider the heat resistance of the material, withstand voltage, the amount of glue and the thickness of the medium, and set a reasonable high-level board pressing program.

4. Difficulties in drilling drilling. The use of high-TG, high-speed, high-frequency, and thick copper special plates increases the difficulty of drilling roughness, drilling burrs and removing drilling dirt.

Shenzhen Hengkesheng Electronics Co., Ltd. is an emerging high-tech enterprise. As a professional multi-layer circuit board factory, its main products are multilayer circuit boards, HDI board proofing, HDI circuit boards, blind buried via circuit boards, rigid-flex circuit boards, PCB circuit board proofing, ceramic circuit boards, and high-density connection boards. , Rigid-flex board, FPC, multilayer printed circuit board, etc. Specially provide superior and fast service for domestic and foreign high-tech enterprises and scientific research units. Hengkesheng Electronics has been selected as the annual outstanding supplier of many well-known enterprises at home and abroad. It is a private technology enterprise recognized by the Shenzhen Municipal Science and Technology Bureau. At the same time, the company has worked together in the development process to create an excellent culture and an excellent enterprise. Adhere to the spirit of perseverance and continue to absorb emerging international technologies. Improve product quality and exceed customer needs.