Difficulties in the manufacture of multilayer circuit boards
1, inter-layer alignment difficulties. Due to the large number of multi-layer circuit board layers, customers have more and more strict requirements on the alignment degree of PCB layers, and the alignment tolerance between layers is usually controlled at about 75 microns. Considering the large size design of high-level board units, the temperature and humidity of the environment in the graphics transfer workshop, the dislocation superposition caused by the inconsistency of the expansion and contraction of different core board layers, the control of the alignment degree between high-level boards is more difficult. 2. Difficulties in making inner circuit.
Multi-layer circuit board
is made of special materials such as high TG, high speed, high frequency, thick copper, thin dielectric layer, etc., which puts forward high requirements for the control of the inner circuit and graphics size. For example, the line width is small, the open short circuit is increased, and the qualified rate is low. There are many signal layers in the fine line, and the probability of missed detection of AOI in the inner layer is increased. The inner core plate is thin, easy to fold, resulting in poor exposure, easy to roll when etching through the machine, etc. 3, pressing production difficulties. The superposition of multiple inner core boards and prepreg is prone to defects such as skateboards, delamination, resin voids and residual bubbles. It is necessary to fully consider the heat resistance, voltage resistance, filling amount and medium thickness of the material, and set a reasonable high-rise plate pressing program. 4. Difficulties in drilling. The use of high TG, high speed, high frequency, thick copper special plates increases the difficulty of drilling roughness, drilling burrs and removing drilling dirt.
Shenzhen Hengke Sheng Electronics Co., Ltd. is a new high-tech enterprises. As a professional multi-layer circuit board factory, the main products are multi-layer circuit board,
HDI board proofing, HDI circuit board, blind buried hole circuit board, soft and hard combined circuit board, pcb circuit board proofing, ceramic circuit board, high density connection board, soft and hard combined board, FPC, multi-layer printed circuit board, etc. Specially for domestic and foreign high-tech enterprises and scientific research units to provide superior fast service. Hengkesheng Electronics has been selected as the annual outstanding supplier of many well-known enterprises at home and abroad. It is a private technology enterprise recognized by the Shenzhen Municipal Science and Technology Bureau. At the same time, the company has worked together in the development process and is committed to creating excellent culture and excellent enterprises. Adhere to the spirit of perseverance, and constantly absorb international emerging technologies. Improve product quality and exceed customer needs.
Multilayer Circuit Board, Multilayer Circuit Board
Previous Page
Next Page
Previous Page
Next Page
The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
2023-07-28
The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
2023-07-28
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
2023-07-28
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
2023-07-28
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.