Production Process of Soft and Hard Combination Circuit Board
soft and hard combined circuit board, is a flexible circuit board and a hard circuit board, through pressing and other processes, combined according to relevant process requirements, formed with FPC characteristics and PCB characteristics of the circuit board. In the past, the two hard boards were connected by flexible boards and connectors. In order to improve the reliability of the connection between the hard board and the soft board, the soft board is directly made between the two hard boards in the printed circuit board (PCB) factory, which can avoid the subsequent connection process. Both the hard board manufacturer and the soft board manufacturer can now supply the hard and soft board. Under the demand of light and thin end products, the application scope of soft board and soft and hard board will be wider.
High-end functional smart phones are still the main driving force for the development of the hard and soft circuit board market. Due to more functional requirements, such as powerful word processing functions, sending and receiving e-mails, and improving the picture element of digital cameras, the application of hard and soft combination circuit boards in mobile phones has increased, and hard and soft combination board design can be adopted for both static and dynamic functions. In the future, with the diversification of mobile phone functions such as digital TV, mini projector and map function enhancement, the hard and soft combination board is bound to be applied to the whole machine and module.
1. Production Process of Hard and Soft Combined Circuit Board
Because the hard and soft combined circuit board is a combination of FPC and PCB, the production of hard and soft combined circuit board should have both FPC production equipment and PCB production equipment. First of all, the electronic engineer draws the circuit and shape of the hard and soft combination board according to the requirements, and then sends it to the factory that can produce the hard and soft combination board. After the CAM engineer processes and plans the relevant documents, the FPC and PCB production lines required for FPC production line production are arranged to produce PCB. After the two soft boards and hard boards come out, the FPC and PCB are seamlessly laminated with a laminating machine according to the planning requirements of the electronic engineer, after a series of details, the final process of the combination of hard and soft circuit board. A very important link, because the combination of hard and soft circuit boards is difficult and there are many details, before shipment, it is generally necessary to carry out full inspection, because its value is relatively high, so as not to cause loss of relevant interests between the supply and demand sides.
2. Advantages and Disadvantages of Soft and Hard Combined Circuit Board
Advantages: Soft and Hard Combined Circuit Board has the characteristics of FPC and PCB at the same time. Therefore, it can be used in some products with special requirements. It has both certain flexible areas and certain rigid areas, which is of great help to save the internal space of the product, reduce the volume of the finished product and improve the performance of the product.
Disadvantages: The combination of hard and soft circuit boards has many production processes, difficult production, low yield, and more materials and manpower. Therefore, its price is relatively expensive and the production cycle is relatively long.
3. Application fields related to hard and soft combination circuit board
The characteristics of hard and soft combination circuit board determine its application fields to cover all application fields of FPC on PCB, such as
mobile phone
key board and side keys
computer and LCD screen
motherboard and display screen
CD walkman
disk drive
NOTEBOOK
latest application:
hard disk drive (HDD,hard disk drive) suspension circuit and xe package board, etc.
Soft and hard combined circuit board
Previous Page
Previous Page
The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
2023-07-28
The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
2023-07-28
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
2023-07-28
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
2023-07-28
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
National Service Hotline:
Shenzhen Hengke Sheng Electronics Co.
-
Fax: 86-755-27691537
Mailbox: csaa@hengkepcb.com
Website: www.hengkepcb.com
Address: No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province
Copyright: Shenzhen Hengke Sheng Electronics Co., Ltd
Website Construction: China Enterprise Power Longgang