Advantages of multilayer circuit boards
As the name implies, multi-layer circuit board is more than two layers of circuit board can be called multi-layer, such as four layers, six layers, eight layers and so on. Of course, some designs are three-or five-layer circuits, also known as multi-layer PCB boards. For conductive traces larger than two layers, there is an insulating substrate separation between the layers. After each layer of lines is printed, each layer of lines is overlapped by pressing, and then drilled, and the conduction between each layer of lines is realized by vias. The advantage of multi-layer circuit boards is that the lines can be distributed in multiple layers, so that more precise products can be designed, or smaller products can be realized through multi-layer boards, such as mobile phone circuit boards, micro projectors, voice recorders, etc. In addition, multiple layers can increase design flexibility, better control of differential impedance and single-ended impedance, and better output of certain signal frequencies.
Multi-layer circuit board is the inevitable product of the development of electronic technology towards high speed, multi-function, large capacity and small volume. With the continuous development of electronic technology, especially the extensive and in-depth application of large-scale and ultra-large-scale integrated circuits is developing in the direction of high density, high precision and high level of digitization. Technologies such as fine lines, small aperture penetration, blind hole buried hole and high plate thickness aperture ratio have been proposed to meet market demand. Due to the demand for high-speed circuits in the computer and aerospace industries, further increases in packaging density are required. Coupled with the reduction in the size of separate components and the rapid development of microelectronics, electronic devices are also moving in the direction of reducing volume and reducing quality. development. Due to the limitation of available space, it is impossible to further improve the assembly density. Therefore, it is necessary to consider using more printed circuits than double-sided circuit boards, which creates conditions for the emergence of multi-layer circuit boards.
Multilayer Circuit Board, Multilayer Circuit Board
The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
2023-07-28
The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
2023-07-28
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
2023-07-28
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
2023-07-28
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
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