Difficulties in the production of multilayer circuit boards
generally refers to a three-layer or more circuit board, which requires high quality and reliability. Mainly used in communication equipment, high-end servers, medical electronics, aviation, industrial control, military and other fields. In recent years, the market demand of multi-layer circuit boards in the fields of application communication, base station, aviation, military and so on is still strong. With the rapid development of China's telecommunication equipment market, the market prospect of multi-layer circuit boards is broad. The average number of circuit board layers has become an important technical index to measure the technical level and product structure of circuit board manufacturers. However, there are many difficulties in the processing and production of multilayer circuit boards. Compared with the characteristics of conventional circuit board products, multilayer circuit boards have thick boards, multiple layers, dense lines and vias, larger unit sizes, and thinner dielectric layers. At the same time, the requirements for internal space, inter-layer alignment, impedance control and reliability are more stringent. Due to the large number of layers of
multilayer circuit board
, the alignment of the layers at the customer's design end is becoming more and more strict. The alignment tolerance between layers is generally controlled at 75 microns. Considering the design of large size of multi-layer circuit board units, the ambient temperature and humidity of the graphic transfer workshop, the dislocation superposition caused by the inconsistent expansion and contraction of different core boards, and the positioning mode between layers, the alignment degree between multi-layer circuit boards is more difficult to control. Multi-layer circuit board is made of high
TG , high speed, high frequency, thick copper, thin dielectric layer and other special materials. This puts forward high requirements for internal circuit production and pattern size control, such as the integrity of impedance signal transmission, which increases the difficulty of internal circuit production. The line width and line distance are small, the number of open circuits and short circuits increases, the number of short circuits increases, and the qualified rate is low. There are many signal layers in the thin line, and the probability of missing detection in the inner AOI increases. The inner core board is thin, easy to fold and lead to poor exposure, and easy to roll during etching. Multi-layer circuit boards are mostly system boards with large unit size and relatively high scrap cost.
multilayer circuit board
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Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
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In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
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Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
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