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Difficulties in the production of multilayer circuit boards

Difficulties in the production of multilayer circuit boards

  • Categories:Industry News
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  • Time of issue:2020-12-10 12:35
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Difficulties in the production of multilayer circuit boards

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Multilayer circuit boards generally refer to circuit boards with three or more layers, which require high quality and reliability. Mainly used in communication equipment, high-end servers, medical electronics, aviation, industrial control, military and other fields. In recent years, the market demand for multilayer circuit boards in applied communications, base stations, aviation, military and other fields is still strong. With the rapid development of my country's telecommunications equipment market, the market prospects for multilayer circuit boards are broad.

The average number of circuit boards has become an important technical indicator to measure the technical level and product structure of circuit board manufacturers. However, there are also many difficulties in the processing and production of multi-layer circuit boards. Compared with the characteristics of conventional circuit board products, multi-layer circuit boards have thickness, more layers, dense lines and vias, larger unit sizes, and thinner dielectric layers. Features. At the same time, the requirements for internal space, interlayer alignment, impedance control and reliability are more stringent.

Due to the large number of layers of multi-layer circuit boards, the alignment of layers at the customer's design side is becoming more and more strict. The alignment tolerance between layers is generally controlled at 75 microns, taking into account the larger design of the multi-layer circuit board unit size, the ambient temperature and humidity of the graphics transmission workshop, the misalignment stacking caused by the inconsistent expansion of different core boards, and the positioning method between layers , The degree of alignment between layers of multilayer circuit boards is more difficult to control.

Multilayer circuit boards are made of special materials such as high TG, high speed, high frequency, thick copper, and thin dielectric layers. This puts forward very high requirements for internal circuit production and graphic size control, such as the integrity of impedance signal transmission, which increases the difficulty of internal circuit production. The line width and line spacing are small, the number of open circuits and short circuits increases, the number of short circuits increases, and the pass rate is low; there are many signal layers in the thin line, and the probability of missing internal AOI detection increases; the inner core board is thin, which is easy to fold and cause poor exposure, and when etching Easy to roll; multi-layer circuit boards are mostly system boards, with a large unit size, and the cost of scrapping the finished product is relatively high.

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The evaluation system of the circuit board factory should follow the following principles

The evaluation system of the circuit board factory should follow the following principles

Establishing a good cooperative relationship with circuit board factories is conducive to cost reduction, response time reduction and the creation of new market value, etc. The core issue is how to choose the ideal circuit board factory. There are many factors involved in the evaluation of circuit board factories, and the evaluation index systems are diverse, both qualitative and quantitative, and the index weights are also different. Therefore, it is necessary to establish a universal and expandable evaluation index system for circuit board factories. , And the indicator system should follow the following principles:
The use of soft and hard circuit boards?

The use of soft and hard circuit boards?

In our daily life, circuit boards are mostly single-sided, double-sided, or multi-layer boards, rigid boards, metal-based circuit boards, aluminum, copper substrates, thermally conductive fiberboards, etc., do you know what a flexible and rigid circuit board is? Rigid-flex circuit board: refers to a special circuit board made by pressing a rigid circuit board (PCB) and a flexible circuit board (FPC). The main board materials used are rigid board FR4 and flexible board polyimide (PI). Rigid and flexible circuit boards combine the rigid characteristics of rigid circuit boards and the advantages of flexible circuit
Soft and hard circuit board production process

Soft and hard circuit board production process

The flexible and hard circuit board is the flexible circuit board and the rigid circuit board. After pressing and other processes, they are combined according to the relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. In the past, two hard boards were connected by using soft boards and connectors to connect each other. In order to improve the reliability of the connection between the rigid board and the flexible board, the flexible board is directly fabricated between two rigid boards in the printed circuit board (PCB) factory, which can avoid the subsequent connection process, whether it is a rigid board manufacturer or FPC manufacturers are now able to supply rigid-flex boards. Under the demand for light and thin end products, the

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