How much do you know about multilayer circuit boards?
is a wiring board in which two or more conductive layers (copper layers) are stacked on each other. The copper layers are bonded together by a resin layer (prepreg). Drilling and plating has been completed. A multi-substrate is fabricated by stacking two or more circuits together with reliable preset interconnections between them. This technology violated the conservative production process from the beginning. The innermost two layers consist of traditional double-layer panels, while the outer layers are different. Prior to rolling, the inner substrate will be drilled, plated through holes, transferred, developed and etched. The drilled outer layer is the signal layer, which is plated by forming a balanced copper ring on the inner edge of the through hole, and then the layers are rolled together to form a multi-layer circuit board that can be connected to each other by wave soldering. Multi-layer circuit boards are relatively expensive, the manufacturing process is complex, the output is low, and rework is difficult.
Due to the increase in packaging density of integrated circuits, there is a high concentration of interconnection lines. This necessitates the use of a plurality of substrates. Unforeseen design problems such as noise, stray capacitance, and crosstalk can occur in printed circuit layouts. Therefore, the design of
must focus on minimizing the length of the signal line and avoiding parallel lines. Obviously, in a single panel, or even in a double panel, these requirements are not satisfactory due to the limited number of crossovers that can be achieved. In the case of a large number of interconnections and crossover requirements, in order to achieve satisfactory performance, the circuit board must be expanded to more than two layers, thereby presenting a multi-layer circuit board. Therefore, the original intention of manufacturing multi-layer circuit boards is to provide more freedom in selecting the appropriate wiring path for complex or noise-sensitive electronic circuits. , two of which are on the outer surface, and
multi-layer wiring board has at least three conductive layers, and the remaining layers are synthesized in the insulating board. The electrical connection between them is usually achieved by plated through holes in the cross section of the circuit board. Unless otherwise specified, multilayer printed circuit boards, like double-sided boards, are usually plated through holes.
multilayer circuit board
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Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
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