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How much do you know about multilayer circuit boards?

How much do you know about multilayer circuit boards?

  • Categories:Industry News
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  • Time of issue:2020-12-09 12:34
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How much do you know about multilayer circuit boards?

Information

A multilayer circuit board is a circuit board made up of two or more conductive layers (copper layers) superimposed on each other. The copper layers are bonded together by a resin layer (prepreg). Drilling and plating have been completed. Multi-substrates are manufactured by stacking two or more circuits together with reliable preset interconnections between them. This technique violated the conservative production process from the beginning. The two innermost layers consist of traditional double-layer panels, while the outer layers are different. Before rolling, the internal substrate will be drilled, plated through holes, transferred, developed and etched. The outer layer drilled is the signal layer, which is electroplated by forming a balanced copper ring on the inner edge of the through hole, and then these layers are rolled together to form a multilayer circuit board that can be connected to each other by wave soldering.

The multi-layer circuit board is relatively expensive, the manufacturing process is complicated, the output is low, and it is difficult to rework.

Due to the increase in the packaging density of integrated circuits, the interconnection lines are highly concentrated. This necessitates the use of multiple substrates. Unforeseen design issues such as noise, stray capacitance, and crosstalk can occur in printed circuit layouts. Therefore, the design must focus on minimizing the length of the signal line and avoiding parallel traces. Obviously, in a single panel, or even in a double panel, these requirements are not satisfactory due to the limited number of crossovers that can be achieved. In the case of a large number of interconnection and crossover requirements, in order to achieve satisfactory performance, the circuit board must be expanded to more than two layers, thereby presenting a multilayer circuit board. Therefore, the original intention of manufacturing multi-layer circuit boards is to provide more freedom in choosing appropriate wiring paths for complex or noise-sensitive electronic circuits.

Two of them are on the outer surface, and the multilayer wiring board has at least three conductive layers, and the remaining layers are synthesized in the insulating board. The electrical connection between them is usually achieved through plated through holes in the cross section of the circuit board. Unless otherwise specified, multilayer printed circuit boards, like double-sided boards, are usually plated through holes.

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The evaluation system of the circuit board factory should follow the following principles

The evaluation system of the circuit board factory should follow the following principles

Establishing a good cooperative relationship with circuit board factories is conducive to cost reduction, response time reduction and the creation of new market value, etc. The core issue is how to choose the ideal circuit board factory. There are many factors involved in the evaluation of circuit board factories, and the evaluation index systems are diverse, both qualitative and quantitative, and the index weights are also different. Therefore, it is necessary to establish a universal and expandable evaluation index system for circuit board factories. , And the indicator system should follow the following principles:
The use of soft and hard circuit boards?

The use of soft and hard circuit boards?

In our daily life, circuit boards are mostly single-sided, double-sided, or multi-layer boards, rigid boards, metal-based circuit boards, aluminum, copper substrates, thermally conductive fiberboards, etc., do you know what a flexible and rigid circuit board is? Rigid-flex circuit board: refers to a special circuit board made by pressing a rigid circuit board (PCB) and a flexible circuit board (FPC). The main board materials used are rigid board FR4 and flexible board polyimide (PI). Rigid and flexible circuit boards combine the rigid characteristics of rigid circuit boards and the advantages of flexible circuit
Soft and hard circuit board production process

Soft and hard circuit board production process

The flexible and hard circuit board is the flexible circuit board and the rigid circuit board. After pressing and other processes, they are combined according to the relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. In the past, two hard boards were connected by using soft boards and connectors to connect each other. In order to improve the reliability of the connection between the rigid board and the flexible board, the flexible board is directly fabricated between two rigid boards in the printed circuit board (PCB) factory, which can avoid the subsequent connection process, whether it is a rigid board manufacturer or FPC manufacturers are now able to supply rigid-flex boards. Under the demand for light and thin end products, the

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