Processing Technology of Blind Buried Hole Circuit Board
HDI means high-density interconnection, and HDI board is a blind buried hole circuit board. Blind hole refers to a hole that can be seen from the outside, but there is no penetration, and the road board containing lines cannot be seen on the other side. Buried holes are holes that only exist in the inner layer and are completely invisible from the outside. The blind buried hole is different from the through hole. Generally speaking, the diameter of the blind hole is very small (usually no more than 0.15mm) and it is difficult to process by mechanical means, so laser drilling is usually used. Therefore, the processing technology of PCB with blind buried hole is: cutting-internal circuit-laser drilling (drilling blind buried hole)-plating filling or resin plug hole-pressing-drilling through hole-the subsequent process is the same as that of ordinary PCB processing. The
HDI board is a high-density interconnection circuit board. The boards plated by blind holes and pressed twice are HDI boards, which are divided into first-order, third-order, fourth-order and fifth-order HDI. For example, the motherboard of iPhone 6 is the fifth-order HDI. Simply burying a hole is not necessarily HDI.
The proofing of the blind buried hole circuit board is calculated according to the area, such as how much is a square, and then the total area is calculated. Butyl circuit boards are introduced in more detail, and you get what you pay for. Generally, better circuit boards and prices are different. The high technical content of blind buried circuit boards will naturally lead to higher prices.
Through-hole is one of the important components of multilayer printed circuit boards, and the cost of drilling usually accounts for 30%-40% of the manufacturing cost of printed circuit boards. Simply put, each hole on the PCB can be called a. From a functional point of view, vias can be divided into two categories: one is used as an electrical connection between layers; second, it is used to fix or position equipment. In terms of process, these vias generally fall into three categories, namely, blind vias, buried vias, and vias. The blind holes are located on the top and bottom surfaces of the printed circuit board and have a certain depth for connecting the surface circuit and the underlying internal circuit. The depth of the hole usually does not exceed a certain proportion (hole diameter). The buried hole refers to the connection hole located in the inner layer of the printed circuit board and does not extend to the surface of the printed circuit board. The above two kinds of holes are located in the inner layer of the circuit board, and are completed by a through-hole forming process before lamination, and several inner layers may be overlapped in the through-hole forming process. The third type is called a through hole, which passes through the entire circuit board and can be used to realize internal interconnection or as a mounting positioning hole for components. Because through-holes are technically easier to implement and lower in cost, most printed circuit boards use it instead of the other two vias.
Blind buried hole circuit board
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