The future development trend of ceramic circuit board
ceramic circuit board industry development for many years, has been mature. At present, the overall market structure has been clear. Domestic big-name manufacturers leading, small and medium-sized manufacturers began to pour in, indicating that the market is booming. Although the ceramic circuit board is no longer a new product, its application in China has just started. Many small and medium-sized manufacturers began the application of ceramic circuit boards. Compared with other printed circuit boards, ceramic circuit boards can be used as a substitute for the older generation of substrates and can perfectly replace metal substrates and transparent substrates. Because of its high thermal conductivity, high insulation and good thermal expansion matching coefficient, it has become a hot spot in the field of high-power lighting. How to reduce the thermal resistance of
LED ceramic substrate is currently one of the most important issues to improve the luminous efficiency of LED . According to its circuit manufacturing method, it can be divided into thick film ceramic substrate, low temperature co-fired ceramic substrate, thin film ceramic substrate and laser metallization technology. In order to improve the luminous efficiency and service life of
LED , solving the heat dissipation problem of LED products is one of the most important issues at this stage. The development of the LED industry is also focused on high-power, high-brightness, and small-size LED products. Therefore, providing high heat dissipation and precise size of the heat dissipation substrate has become the development trend of the future LED heat dissipation substrate. At present, aluminum nitride substrate and aluminum oxide substrate are used to improve the luminous efficiency of LED . Under this development trend, the alignment accuracy of the heat dissipation substrate itself is extremely strict, and it needs to have the characteristics of high heat dissipation, small size, and strong metal circuit bonding. Therefore, the use of laser technology will become an important way to promote the continuous improvement of light-emitting diodes to high power. The future
ceramic circuit board needs to step out of the embrace of LED to welcome the arrival of the new industrial era. At present, the largest application of ceramic circuit boards is in the field of LED
, but the market of PCB is very bad. On the eve of the intelligent era, ceramic circuit boards should be prepared to face. The application field of artificial intelligence chips will become the new territory of ceramic circuit boards, and the field of LED is just beginning. In the "
Made in China 2050" environment, the printed circuit board industry must keep pace. In the era of data is king, ceramic circuit boards must be constantly updated to keep up with the pace of the industrial revolution. I hope that ceramic circuit board manufacturers can continue to improve and remain invincible in the wave of the industrial revolution.
ceramic circuit board
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The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
2023-07-28
The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
2023-07-28
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
2023-07-28
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
2023-07-28
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
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