The ceramic circuit board industry has developed for many years and has matured. At present, the overall market structure is clear. Domestic big-name manufacturers are leading, and small and medium-sized manufacturers are beginning to flood in, indicating that the market is booming. Although the ceramic circuit board is no longer a new product, its application in China has just started. Many small and medium-sized manufacturers have started the application of ceramic circuit boards. Compared with other printed circuit boards, ceramic circuit boards can be used as substitutes for older generation substrates, and can perfectly replace metal substrates and transparent substrates. Because of its high thermal conductivity, high insulation, and good thermal expansion matching coefficient, it has become a hot spot in the field of high-power lighting.

How to reduce the thermal resistance of the LED ceramic substrate is currently one of the most important issues to improve the luminous efficiency of the LED. According to its circuit manufacturing method, it can be divided into thick film ceramic substrate, low temperature co-fired ceramic substrate, thin film ceramic substrate and laser metallization technology.

In order to improve the luminous efficiency and service life of LEDs, solving the heat dissipation problem of LED products is one of the most important issues at this stage. The development of the LED industry is also concentrated on high-power, high-brightness, and small-size LED products. Therefore, providing a heat dissipation substrate with high heat dissipation and accurate size has become the development trend of LED heat dissipation substrates in the future. At present, aluminum nitride substrates and aluminum oxide substrates are used to improve the luminous efficiency of LEDs. Under this development trend, the alignment accuracy requirements of the heat dissipation substrate itself are extremely strict, and it needs to have the characteristics of high heat dissipation, small size, and strong bonding force of metal circuits. Therefore, the use of laser technology will become an important way to promote the continuous improvement of light-emitting diodes to high power.

The ceramic circuit boards of the future need to get out of the embrace of LEDs to welcome the arrival of the new industrial era.

At present, the largest application of ceramic circuit boards is in the LED field, but the PCB market is very bad. On the eve of the intelligent age, ceramic circuit boards must be prepared to face it. The application field of artificial intelligence chips will become a new territory for ceramic circuit boards, and the field of LEDs is just getting started.

In the “Made in China 2050” environment, the printed circuit board industry must keep pace. In an era when data is king, ceramic circuit boards must be constantly updated to keep up with the pace of the industrial revolution. I hope that ceramic circuit board manufacturers can continue to make progress and remain invincible in the wave of the industrial revolution.