The application field of ceramic circuit board is more and more widely
Compared with other organic circuit boards, ceramic circuit board has obvious advantages such as high thermal conductivity and good thermal expansion coefficient matching. At present, it has been well and stably applied in the field of automotive sensors and high-end lighting, and its products have performed particularly well. The output is gradually stable, increasing year by year, and there have been small outbreaks recently. The technology tends to be perfect and has been applied for a patent in China. It can combine metal layers and ceramics in an ionic state, which is higher than other methods such as copper plating and printing.
With the progress of the times, we will find ceramic circuit boards in more and more fields. With the early planning of the 5G era, a base station with a coverage density ten times higher than it is now will be established soon, which is undoubtedly a huge business opportunity for electronic products such as ceramic circuit boards. This rare opportunity, no wonder domestic manufacturers have stepped up their efforts. The transition period from 4G to 5G is a good time for all electronics manufacturers to display their talents. For example, at the cloud conference held in Hangzhou not long ago, Alibaba cloud said that the price of China's cloud products has been comprehensively lowered, and the decline of core products has even reached 50%. As soon as the news came out, domestic cloud computing manufacturers were moved. Not only Internet giants such as BAT , but also other industry enterprises and independent cloud companies were ready to compete in the domestic market.
In fact, cloud computing has become one of the competitive areas in China. Technically speaking, it is a computing mode that can quickly use shared computing facilities, storage devices, applications and other resources anytime and anywhere through the Internet. Cloud computing system consists of four basic parts: cloud platform, cloud storage, cloud terminal and cloud security. The essence is to integrate the resources of one data center or multiple data centers with a large number of hardware resources such as CPU , memory, switches, etc., to provide users with various services such as computing environment, development platform, software application, etc.
With the advancement of technology and the development of the times, products will be updated and iterated faster with people's needs. The more functions that can be realized, the stricter the hardware requirements. The application of ceramic circuit boards with more advantages in the selection of substrate materials is the driving force of the times. The silent killing in the field of cloud computing should alert all electronic manufacturers. They should not only choose ceramic circuit board as the material that meets the needs of the times in terms of hardware, but also pay attention to innovation, learn more about the research and development of domestic patented special technologies, and avoid entering the vicious circle of "technology outdated - market share shrinking - unable to carry out scientific research " .
ceramic circuit board
Previous Page
The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
2023-07-28
The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
2023-07-28
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
2023-07-28
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
2023-07-28
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
National Service Hotline:
Shenzhen Hengke Sheng Electronics Co.
-
Fax: 86-755-27691537
Mailbox: csaa@hengkepcb.com
Website: www.hengkepcb.com
Address: No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province
Copyright: Shenzhen Hengke Sheng Electronics Co., Ltd
Website Construction: China Enterprise Power Longgang