The future prospects of ceramic circuit boards are promising.
The rapid development of the Internet of Things in recent years will strongly promote the transformation and upgrading of traditional industries. Lead the rapid development of emerging industries and trigger deep-seated reforms in social production and economic development. In the entire Internet of Things industry chain, MEMS sensors are playing an increasingly important role, playing a central role in the upcoming era of intelligent Internet of Things, bringing smarter and sharper perception to new technology products. But there is also a certain degree of difficulty, ceramic circuit boards can make up.
We know that the MEMS sensor is a micro-sensor manufactured using microelectronics and micro-machining technology. Therefore, it has the characteristics of miniaturization, integration, intelligence, low cost and high performance. However, because it will be micro-structure, micro-sensor, micro-controller and other components in a chip or micro-limited space, the work of heat dissipation is a big problem. Therefore, the ceramic circuit board with higher thermal conductivity than the traditional printed circuit board is a good helper.
micron or micro nano scale MEMS device part of high precision but very fragile, not too much stress. The expansion coefficient of the ceramic in the ceramic circuit board is close to the expansion coefficient of Si in the chip material, and no large stress is generated during packaging or temperature changes. However, MEMS devices generally work in various application environments such as strong vibration, acid and alkali substances, other chemicals or organic solvents. Therefore, the packaging structure and packaging materials are required to adapt to various complex working environments. The copper layer of the ceramic circuit board does not contain an oxide layer, and has corrosion resistance in various complex environments, which improves stability and reliability.
With the application of miniaturization and precision design to adapt to new technologies, the requirements for three-dimensional graphics drawing on the packaging substrate are getting higher and higher. And unlike the traditional IC (IC ) package, the purpose of the traditional IC package is to provide physical support for the IC chip, protect it from environmental interference and damage, and realize electrical interconnection with external signals, power and ground. However, MEMS devices need to face a harsh and complex external environment, so their interaction with the external environment and structural complexity increase their packaging difficulties. Therefore, the traditional packaging substrate material is difficult to meet it, so the ceramic circuit board as a packaging material can reduce the packaging difficulty.
In the ceramic circuit board manufacturing technology, the ceramic circuit board manufactured by DPC technology can be designed into a three-dimensional cavity structure, which can meet the requirements of MEMS devices not affected by certain environments, and the design of three-dimensional circuit patterns is also very flexible. It is believed that in the near future, this ceramic circuit board suitable for MEMS sensor will shine in the new era!
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In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
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Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
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