The rapid development of the Internet of Things in recent years will strongly promote the transformation and upgrading of traditional industries. Leading the rapid development of emerging industries, triggering in-depth reforms of social production and economic development. In the entire Internet of Things industry chain, MEMS sensors play an increasingly important role and play a central role in the upcoming era of intelligent Internet of Things, bringing smarter and more sensitive perception to new technology products. But there are certain difficulties, ceramic circuit boards can make up for it.

As we know, MEMS sensor is a kind of micro sensor manufactured by using microelectronics and micro processing technology. Therefore, it has the characteristics of miniaturization, integration, intelligence, low cost and high performance. However, because it makes microstructures, microsensors, microcontrollers and other components in a chip or micro-limited space, heat dissipation is a big problem during operation. Therefore, ceramic circuit boards with higher thermal conductivity than traditional printed circuit boards are a good helper.

Micron or micro-nano-scale MEMS devices have high accuracy but are very fragile, and the stress should not be too large. The expansion coefficient of the ceramic in the ceramic circuit board is close to the expansion coefficient of Si in the chip material, and no large stress will be generated during packaging or temperature changes. However, MEMS devices generally work in various application environments such as strong vibration, acid-base substances, other chemical substances, or organic solvents. Therefore, the packaging structure and packaging materials are required to be able to adapt to various complex working environments. The copper layer of the ceramic circuit board does not contain an oxide layer, and has corrosion resistance in various complex environments, which improves stability and reliability.

With the application of miniaturization and precision design in order to adapt to new technologies, the requirements for drawing three-dimensional graphics on the package substrate are getting higher and higher. And different from traditional integrated circuit (IC) packaging, the purpose of traditional IC packaging is to provide physical support for the IC chip, protect it from environmental interference and damage, and achieve electrical interconnection with external signals, energy, and grounding. However, the MEMS device needs to face a harsh and complex external environment, so its interaction with the external environment and the complexity of the structure increase the difficulty of its packaging. Therefore, it is difficult for traditional packaging substrate materials to meet it, so ceramic circuit boards as packaging materials can reduce the difficulty of packaging.

In the ceramic circuit board manufacturing technology, the ceramic circuit board manufactured by DPC technology can be designed into a three-dimensional chamber structure, which can meet the requirements of MEMS devices not to be affected by certain environments, and the design of three-dimensional circuit patterns is also very flexible. I believe that in the near future, this ceramic circuit board suitable for MEMS sensors will shine in the new era!