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Why use ceramic circuit boards

Why use ceramic circuit boards

  • Categories:Industry News
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  • Time of issue:2020-10-21 17:51
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Why use ceramic circuit boards

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The general PCB is made of copper foil and the substrate. Due to thermal stress, chemical factors, improper production process and other reasons in its processing, the PCB substrate is prone to bend to varying degrees. Another kind of PCB substrate, namely ceramic circuit board, is greatly superior to the general glass fiber PCB in terms of heat dissipation performance, energization ability, insulation, thermal expansion coefficient, etc. It is widely used in high-power electronic modules, aerospace, and military needs. Electronics and other products.

We usually use PCB adhesives to bond copper foil and substrates. Ceramic circuit boards use bonding methods to integrate copper foil and ceramic circuit boards in high-temperature environments. The bonding force is strong, the copper foil does not fall off, the reliability is high, and the temperature is high. It can maintain stable performance even in high humidity environments.
The main material of ceramic circuit board
1. Alumina (Al2O3)

Alumina is the most commonly used substrate material in ceramic circuit boards. It has high strength and chemical stability to many other oxide ceramics in terms of mechanical, thermal, and electrical properties. It has a rich source of raw materials and is suitable for various manufacturing technologies and different shapes.

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Ceramic circuit boards are classified into 75 porcelain, 96 porcelain and 99.5 porcelain according to the percentage of alumina. The content of alumina is different, the electrical properties are almost unaffected, but the mechanical properties and thermal conductivity vary greatly. Substrates with low purity have more glass phases and large surface roughness. The higher the purity of the substrate, the more shiny, dense, and low dielectric loss, but the higher the price.
2. Beryllium oxide (BeO)

If ceramic circuit boards have higher thermal conductivity than metal aluminum and require high thermal conductivity, the temperature will drop rapidly when the temperature exceeds 300°C, but its toxicity limits its own development.
3. Aluminum Nitride (AlN)

Aluminum nitride ceramics is based on aluminum nitride powder as the main crystalline phase ceramics. Compared with alumina ceramic circuit boards, it has higher insulation resistance, insulation withstand voltage and low dielectric constant. Its thermal conductivity is 710 times that of Al2O3, and its coefficient of thermal expansion (CTE) almost matches that of silicon wafers, which is very important for high-power semiconductor chips. In the manufacturing process of ceramic circuit boards, the thermal conductivity of AlN is greatly affected by the residual oxygen impurity content, which can reduce the oxygen content and significantly increase the thermal conductivity. The thermal conductivity of the current process production level has reached 170W/(m·K) or more.

 

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The evaluation system of the circuit board factory should follow the following principles

The evaluation system of the circuit board factory should follow the following principles

Establishing a good cooperative relationship with circuit board factories is conducive to cost reduction, response time reduction and the creation of new market value, etc. The core issue is how to choose the ideal circuit board factory. There are many factors involved in the evaluation of circuit board factories, and the evaluation index systems are diverse, both qualitative and quantitative, and the index weights are also different. Therefore, it is necessary to establish a universal and expandable evaluation index system for circuit board factories. , And the indicator system should follow the following principles:
The use of soft and hard circuit boards?

The use of soft and hard circuit boards?

In our daily life, circuit boards are mostly single-sided, double-sided, or multi-layer boards, rigid boards, metal-based circuit boards, aluminum, copper substrates, thermally conductive fiberboards, etc., do you know what a flexible and rigid circuit board is? Rigid-flex circuit board: refers to a special circuit board made by pressing a rigid circuit board (PCB) and a flexible circuit board (FPC). The main board materials used are rigid board FR4 and flexible board polyimide (PI). Rigid and flexible circuit boards combine the rigid characteristics of rigid circuit boards and the advantages of flexible circuit
Soft and hard circuit board production process

Soft and hard circuit board production process

The flexible and hard circuit board is the flexible circuit board and the rigid circuit board. After pressing and other processes, they are combined according to the relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. In the past, two hard boards were connected by using soft boards and connectors to connect each other. In order to improve the reliability of the connection between the rigid board and the flexible board, the flexible board is directly fabricated between two rigid boards in the printed circuit board (PCB) factory, which can avoid the subsequent connection process, whether it is a rigid board manufacturer or FPC manufacturers are now able to supply rigid-flex boards. Under the demand for light and thin end products, the

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