Multilayer circuit board processing dictionary Baking refers to the drying of the liquid food film surface through warm drying to facilitate exposure and development of the negative film. Most of the tooth process and the coating process work in the same room. The most commonly used methods of pre-baking are water stove and oven. Starting from the small part of electronics, the precautions for the dictionary baking process of multilayer circuit board processing are introduced below.

　　1. When the PCB circuit board adopts the oven, it must have north wind and constant temperature control, and the baking temperature of the dictionary is uniform. And it should be clean and free of impurities so as not to fall into the oven.

　　2, do not use natural drying. Drying must be complete. Otherwise, the film will adhere easily and the exposure will be poor.

　　3. After the PCB multilayer circuit board processing dictionary is baked, the multilayer circuit board should be exposed to the negative film after air cooling or natural cooling.

　　4. After baking the multi-layer circuit board dictionary, apply it for up to 2 days until the development suspension time. When the humidity is high, you want to expose and develop it in half a day.

　　5. The requirements for liquid photoresist models are also different, so you must read the instructions carefully and adjust the process parameters, such as thickness, temperature, time, etc., according to production practices.

　　 It is important to control the temperature and time of baking in advance. The temperature is too high or the time is too long, the development is difficult, and the film cannot be removed well. The temperature is too low or the time is too short, the drying is not complete, the film is under pressure, the film is easy to bond, the exposure is poor, and it is easy to cause damage to the film. Therefore, multi-layer circuit board processing is suitable for dictionary baking, and the phenomenon and film removal speed is fast, and the graphics quality is good.

Shenzhen Hengkesheng Electronics Co., Ltd. was established in 2001 with a total investment of 150 million US dollars. It covers an area of ​​100,000 square meters and a workshop area of ​​150,000 square meters. There are two modern factories in Shenzhen and Qingyuan. The company is an emerging high-tech enterprise. The main products are high-density connection boards, HDI circuit boards, multilayer printed circuit boards, etc. The annual output exceeds 900,000 square meters. The company has passed ISO9001, and all products have passed UL, QS9000, and ROHS certification. Specially provide superior and fast service for domestic and foreign high-tech enterprises and scientific research units.