Precautions for Processing Pre-Baking in Multi-Layer Circuit Board Factory
multi-layer circuit board processing dictionary baking refers to the drying of the liquid light inner food film surface through warm drying to facilitate the exposure and development of the negative. The dental process works mostly in the same room as the coating process. The most commonly used methods of pre-baking are water stoves and ovens. The following from the electronic small article, introduced the multilayer circuit board processing dictionary baking process matters needing attention.
1. When the PCB circuit board uses an oven, it must have north wind and constant temperature control, and the dictionary baking temperature is uniform. And to be clean, no impurities, so as not to fall into the oven.
2, do not use natural drying. The drying must be complete. Otherwise, the film is easy to bond and poorly exposed.
3 3, PCB multilayer circuit board processing dictionary after baking, multilayer circuit board should be in air cooling or natural cooling after the negative alignment exposure.
4. After baking the multi-layer circuit board dictionary, apply it for up to 2 days until the development suspension time. When the humidity is high, you want to expose it for development within half a day.
5. The requirements of the liquid photoresist model are also different, so you must read the instructions carefully and adjust the process parameters, such as thickness, temperature, time, etc., according to production practice.
It is important to control the temperature and time of the roast in advance. If the temperature is too high or the time is too long, the development is difficult and the film cannot be removed well. The temperature is too low or the time is too short, the drying is not complete, the film is under pressure, it is easy to bond the film, the exposure is poor, and it is easy to cause the film damage. Therefore, multi-layer circuit board processing is suitable for dictionary baking, phenomenon and film removal speed is fast, and the graphics quality is good.
Shenzhen Hengke Sheng Electronics Co., Ltd. was established in 2001 with a total investment of US $0.15 billion, covering an area of 100000 square meters and a plant area of 150000 square meters. In Shenzhen, Qingyuan has two modern factories. The company is a new high-tech enterprises. The main products are high-density connection boards, HDI circuit boards, multilayer printed circuit boards, etc. Annual output of more than 900000 square meters, enterprises through the ISO9001, products are through UL, QS9000, ROHS certification. Specially for domestic and foreign high-tech enterprises and scientific research units to provide superior fast service.
multilayer circuit board
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