Precautions for Processing Pre-Baking in Multi-Layer Circuit Board Factory
multi-layer circuit board processing dictionary baking refers to the drying of the liquid light inner food film surface through warm drying to facilitate the exposure and development of the negative. The dental process works mostly in the same room as the coating process. The most commonly used methods of pre-baking are water stoves and ovens. The following from the electronic small article, introduced the multilayer circuit board processing dictionary baking process matters needing attention.
1. When the PCB circuit board uses an oven, it must have north wind and constant temperature control, and the dictionary baking temperature is uniform. And to be clean, no impurities, so as not to fall into the oven.
2, do not use natural drying. The drying must be complete. Otherwise, the film is easy to bond and poorly exposed.
3 3, PCB multilayer circuit board processing dictionary after baking, multilayer circuit board should be in air cooling or natural cooling after the negative alignment exposure.
4. After baking the multi-layer circuit board dictionary, apply it for up to 2 days until the development suspension time. When the humidity is high, you want to expose it for development within half a day.
5. The requirements of the liquid photoresist model are also different, so you must read the instructions carefully and adjust the process parameters, such as thickness, temperature, time, etc., according to production practice.
It is important to control the temperature and time of the roast in advance. If the temperature is too high or the time is too long, the development is difficult and the film cannot be removed well. The temperature is too low or the time is too short, the drying is not complete, the film is under pressure, it is easy to bond the film, the exposure is poor, and it is easy to cause the film damage. Therefore, multi-layer circuit board processing is suitable for dictionary baking, phenomenon and film removal speed is fast, and the graphics quality is good.
Shenzhen Hengke Sheng Electronics Co., Ltd. was established in 2001 with a total investment of US $0.15 billion, covering an area of 100000 square meters and a plant area of 150000 square meters. In Shenzhen, Qingyuan has two modern factories. The company is a new high-tech enterprises. The main products are high-density connection boards, HDI circuit boards, multilayer printed circuit boards, etc. Annual output of more than 900000 square meters, enterprises through the ISO9001, products are through UL, QS9000, ROHS certification. Specially for domestic and foreign high-tech enterprises and scientific research units to provide superior fast service.
multilayer circuit board
The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
2023-07-28
The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
2023-07-28
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
2023-07-28
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
2023-07-28
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
National Service Hotline:
Shenzhen Hengke Sheng Electronics Co.
-
Fax: 86-755-27691537
Mailbox: csaa@hengkepcb.com
Website: www.hengkepcb.com
Address: No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province
Copyright: Shenzhen Hengke Sheng Electronics Co., Ltd
Website Construction: China Enterprise Power Longgang