Blind buried hole circuit board: the production and advantages of this board circuit board
Advantages of blind vias and burying through PCB blind buried circuit boards:
eliminates a large number of through-hole designs, improving wiring density and packaging density;
diversifies the internal interconnection structure design of multilayer boards And complicate it;
The reliability of multilayer boards and the electrical performance of electronic products have been significantly improved.
buried hole design and production:
Compared with the traditional multilayer board, the production process of the blind buried hole circuit board is more complicated and the cost is higher. General specifications for buried hole, ordinary through hole and PAD size.
Blind Buried Hole Circuit Board Design and Production:
Circuit board with extremely high density double-sided SMD design, the upper and lower layers will move up and down, and the I / O vias will interfere with each other, especially In the case of via pad design, it is even more troublesome. Blind holes can solve this problem. In addition to the popularity of radio communication, the design of the circuit must also reach the RF (radio frequency) range, which exceeds 1GHz. Blind hole design can meet this requirement. There are three different methods for the production process of
blind buried hole circuit board:
1. Mechanical fixed depth drilling
In the traditional multilayer board manufacturing process, after pressing, use a drilling machine Set the Z-axis depth. However, there are several problems with this method:
Only one bit at a time will produce a very low output
The drilling machine table height is strictly required, the drilling depth of each spindle must be consistent, otherwise it is difficult to control the depth of each hole
Plating in the hole is difficult, especially if the depth is greater than the diameter of the hole, it is almost impossible to plate in the hole.
The limitations of the above method make this method gradually not used.
2. Sequential lamination
Taking an eight-layer board as an example, the continuous pressing method can make blind holes and buried holes at the same time. First, make four inner panels in the way of general double-sided skin and PTH (other combinations can also be used; six-layer double-sided panels, upper and lower double-sided panels and inner four-layer panels), and then press the four panels together to form a Four-layer board. The production of the through hole is completed. Compared with other methods, this method is long and costly, so it is not universal.
3. The non-machining method of the establishment process
At present, this method is favored by the global industry, and the domestic industry cannot tolerate it yet. Many large factories have manufacturing experience.
Blind buried hole circuit board
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