Multi-layer circuit boards-considerations for multi-layer circuit board design
can effectively improve the integrity of the signal and reduce the degree of signal interference to a very low level. The design of
multi-layer circuit board
is a necessary skill for hardware engineers. Knowing some basic concepts related tomultilayer circuit board 
1
, when designingmultilayer circuit board , the first attention is the distribution of each layer, which is directly related to the performance of the product; 2
, under the device surface (second layer) is the ground plane, providing the device shielding layer and providing the reference plane for the device surface wiring;3
, all signal layers should be adjacent to the ground plane as much as possible;4
, try to avoidmulti-layer circuit board two signal layers directly adjacent; 5
, the main power supply is adjacent to it as much as possible;6
, in principle, symmetrical structure design should be adopted, the meaning of symmetry includes: dielectric layer thickness and type, copper foil thickness, graphics;7
,multi-layer circuit board distribution type (large copper foil layer, line layer) symmetry.
multilayer circuit board, multilayer circuit board, HDI board proofing, PCB circuit board factory, multilayer circuit board factory
The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
2023-07-28
The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
2023-07-28
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
2023-07-28
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
2023-07-28
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
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