The precautions that multi-layer circuit board factories need to follow in the process of multi-layer circuit board routing design are as follows:

(1) The setting principle of the spacing of printed wiring of components in the multilayer circuit board factory. The spacing constraints between different networks are determined by factors such as electrical insulation, manufacturing process, and the size of the spacing between printed traces of components. At the same time, setting the spacing also takes into account the production capacity of the multilayer circuit board factory.

(2) The choice of routing form at the corner of the circuit by the multilayer circuit board factory. In order to make the multi-layer circuit board easy to manufacture and beautiful, it is necessary to set the corner mode of the circuit and the selection of the wiring form of the corner of the circuit when designing the wiring. Can choose 45°, 90° and arc. The connection between the wire and the pad should also be as smooth as possible to avoid small spikes. Multilayer circuit board manufacturers can use the method of patching to solve the problem.

(3) The determination method of the design trace width of the multilayer circuit board factory. The width of the trace is determined by factors such as the level of current flowing through the wire and anti-interference. The larger the overcurrent flowing through the current, the wider the trace should be. The power line should be wider than the signal line. In order to ensure the stability of the ground potential, the ground wire should also be wider. In order to ensure the anti-stripping strength and working reliability of the wire, the multilayer circuit board factory should use the widest possible wire to reduce the line impedance and improve the anti-interference performance within the allowable range of the board area and density.

(4) Multilayer circuit board factory designs anti-interference and electromagnetic shielding of wires. The main causes of interference on the wires are the interference introduced between the wires and the crosstalk between the signal wires. The reasonable arrangement and layout of the wiring and grounding methods can effectively reduce the sources of interference and make the designed multilayer circuit board better. The electromagnetic compatibility performance.