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Multilayer circuit board factory: matters needing attention in the layout design of multilayer circuit board

Multilayer circuit board factory: matters needing attention in the layout design of multilayer circuit board

  • Categories:Industry News
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  • Time of issue:2020-07-19 12:03
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Multilayer circuit board factory: matters needing attention in the layout design of multilayer circuit board

Information

The precautions that multi-layer circuit board factories need to follow in the process of multi-layer circuit board routing design are as follows:

 

(1) The setting principle of the spacing of printed wiring of components in the multilayer circuit board factory. The spacing constraints between different networks are determined by factors such as electrical insulation, manufacturing process, and the size of the spacing between printed traces of components. At the same time, setting the spacing also takes into account the production capacity of the multilayer circuit board factory.

 

(2) The choice of routing form at the corner of the circuit by the multilayer circuit board factory. In order to make the multi-layer circuit board easy to manufacture and beautiful, it is necessary to set the corner mode of the circuit and the selection of the wiring form of the corner of the circuit when designing the wiring. Can choose 45°, 90° and arc. The connection between the wire and the pad should also be as smooth as possible to avoid small spikes. Multilayer circuit board manufacturers can use the method of patching to solve the problem.

 

(3) The determination method of the design trace width of the multilayer circuit board factory. The width of the trace is determined by factors such as the level of current flowing through the wire and anti-interference. The larger the overcurrent flowing through the current, the wider the trace should be. The power line should be wider than the signal line. In order to ensure the stability of the ground potential, the ground wire should also be wider. In order to ensure the anti-stripping strength and working reliability of the wire, the multilayer circuit board factory should use the widest possible wire to reduce the line impedance and improve the anti-interference performance within the allowable range of the board area and density.

 

(4) Multilayer circuit board factory designs anti-interference and electromagnetic shielding of wires. The main causes of interference on the wires are the interference introduced between the wires and the crosstalk between the signal wires. The reasonable arrangement and layout of the wiring and grounding methods can effectively reduce the sources of interference and make the designed multilayer circuit board better. The electromagnetic compatibility performance.

Keyword:

The evaluation system of the circuit board factory should follow the following principles

The evaluation system of the circuit board factory should follow the following principles

Establishing a good cooperative relationship with circuit board factories is conducive to cost reduction, response time reduction and the creation of new market value, etc. The core issue is how to choose the ideal circuit board factory. There are many factors involved in the evaluation of circuit board factories, and the evaluation index systems are diverse, both qualitative and quantitative, and the index weights are also different. Therefore, it is necessary to establish a universal and expandable evaluation index system for circuit board factories. , And the indicator system should follow the following principles:
The use of soft and hard circuit boards?

The use of soft and hard circuit boards?

In our daily life, circuit boards are mostly single-sided, double-sided, or multi-layer boards, rigid boards, metal-based circuit boards, aluminum, copper substrates, thermally conductive fiberboards, etc., do you know what a flexible and rigid circuit board is? Rigid-flex circuit board: refers to a special circuit board made by pressing a rigid circuit board (PCB) and a flexible circuit board (FPC). The main board materials used are rigid board FR4 and flexible board polyimide (PI). Rigid and flexible circuit boards combine the rigid characteristics of rigid circuit boards and the advantages of flexible circuit
Soft and hard circuit board production process

Soft and hard circuit board production process

The flexible and hard circuit board is the flexible circuit board and the rigid circuit board. After pressing and other processes, they are combined according to the relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. In the past, two hard boards were connected by using soft boards and connectors to connect each other. In order to improve the reliability of the connection between the rigid board and the flexible board, the flexible board is directly fabricated between two rigid boards in the printed circuit board (PCB) factory, which can avoid the subsequent connection process, whether it is a rigid board manufacturer or FPC manufacturers are now able to supply rigid-flex boards. Under the demand for light and thin end products, the

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