Multi-layer circuit board factory: precautions for multi-layer circuit board routing design
multilayer circuit board factory in the multilayer circuit board trace design process need to follow the matters needing attention as follows:
( 1 ) multilayer circuit board factory in the component printed trace spacing setting principle. The spacing constraints between different networks are determined by factors such as electrical insulation, manufacturing process and the size of the spacing of the printed traces of the components. At the same time, setting the spacing should also take into account the production capacity of multilayer circuit board factory .
( ) Multilayer Circuit Board Factory in line corner routing form option. In order to make the multi-layer circuit board easy to manufacture and beautiful, it is necessary to set the corner mode of the line and the choice of the line corner routing form during the routing design. You can choose 45 °, 90 ° and circular arc. The connection between the wire and the pad should also be as smooth as possible to avoid small pointed feet. multilayer circuit board factory can be solved by filling drops.
( 3 ) Multi-layer Circuit Board Factory Design Line Width Determination Method. The width of the trace is determined by the current level and anti-interference factors flowing through the wire. The greater the current flowing through the wire, the wider the trace should be. The power line should be wider than the signal line. In order to ensure the stability of the ground potential, the ground wire should also be wide. In order to ensure the anti-peeling strength and working reliability of the wire, multi-layer circuit board factory should use as wide a wire as possible to reduce the line impedance and improve the anti-interference performance within the allowable range of the board area and density.
( ) Multilayer PCB Factory
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The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
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The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
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Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
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In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
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Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
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