Multilayer Circuit Board Factory: Design Steps for Multilayer Circuit Board
multi-layer circuit board is basically the same as that of the conventional PCB board, except that the walking line of the intermediate signal layer and the internal electrical layer need to be segmented. On the whole, the design of multi-layer circuit board is divided into the following stages:
1 , multi-layer circuit board planning, mainly planning the physical size of multi-layer circuit board, component packaging form, component installation method, circuit board layer structure, namely single-layer, double-layer and multi-layer board.
2 , indicating job parameter settings, job environment parameter settings, and job layer parameter settings. Correctly and reasonably set the multi-layer circuit board environmental parameters, the circuit board design is very convenient, and the work efficiency is improved.
3 , component layout and adjustment, after the current work is accurate, the network table can be imported into PCB . The layout and adjustment of components is an important work in the design of multilayer circuit board , which directly affects the subsequent wiring and the division of the inner electrical layer.
4 , in the software layer stack manager, focus on defining and setting the specific layer structure of the multi-layer circuit board middle layer, mainly the number of intermediate signal layers and internal electrical layers, upper and lower structures, etc.
5 . The inner electrical layer is divided. It is usually necessary to divide the inner electrical layer into multiple isolated areas, and connect each area to a specific power network. This is an important difference between multilayer boards and ordinary boards, and it is also an important part of the design of the multilayer circuit board.
6 , wiring rule setting, mainly to set various specifications for circuit wiring, wire width, parallel line spacing, safe spacing between wires and pads, via size, etc. Good wiring rules can ensure the safety of circuit board wiring, but also meet the requirements of the production process, cost savings.
7 , wiring and adjustment, special attention should be paid to the layout and wiring although there is a sequence, but in the design project, the layout of the circuit board is often adjusted according to the needs of wiring and internal electrical layer segmentation, or the wiring is adjusted according to the layout, they are a process of mutual consideration and mutual adjustment.
8 , other auxiliary operations, such as copper application and tear drop filling, as well as document processing such as report output and storage printing, these files can be used to check and modify multi-layer circuit board , can also be used as a list of purchased components.
multilayer circuit board, multilayer circuit board, PCB circuit board factory, high frequency circuit board, multilayer circuit board factory
The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
2023-07-28
The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
2023-07-28
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
2023-07-28
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
2023-07-28
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
National Service Hotline:
Shenzhen Hengke Sheng Electronics Co.
-
Fax: 86-755-27691537
Mailbox: csaa@hengkepcb.com
Website: www.hengkepcb.com
Address: No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province
Copyright: Shenzhen Hengke Sheng Electronics Co., Ltd
Website Construction: China Enterprise Power Longgang