Parameters such as the total thickness and number of layers of the multilayer circuit board are limited by the characteristics of the board. Special plates generally have a limited variety of plates with different thicknesses, so the designer should consider the characteristic parameters and the limitations of the processing technology of the multilayer circuit board in the process of multi-layer circuit board design.

As the name implies, the laminated multilayer circuit board is a process of bonding each layer of circuit pieces to form a whole. The whole process includes kiss pressure, full pressure, and cold pressure. In the kiss-pressing stage, the resin infiltrates the bonding surface, fills the gaps in the line, enters all the pressure, and bonds all the gaps. Cold pressing is to quickly cool the circuit board and keep the size stable. Pay attention to the three major issues of temperature, pressure and time when making laminates. Mainly pay attention to the melting and hardening temperature of the resin, the setting temperature of the hot plate, the actual temperature of the material and the temperature change, etc. Under pressure, the basic principle is to fill the interlayer cavity with resin to discharge interlayer gas and volatile substances. Time parameters mainly include pressure time control, heating time control, gel time and so on.

When a multilayer circuit board lamination process problem occurs, the first thing to consider is to integrate this problem into the process specifications of the multilayer circuit board, and gradually enrich our technical specifications. When a certain amount is reached, the quality will change. Most of the quality problems that occur in the lamination process of multi-layer circuit boards are generally caused by the supplier's raw materials or different lamination loads. However, only a small number of customers can have the corresponding data records, so if most customers can predict the stability and continuity of the quality control of the multilayer circuit board lamination in advance, a lot of losses can be avoided.

The most effective way to solve the problem at present is to inspect the unqualified copper layer on the surface, it is recommended to use hydrochloric acid, and then use a machine brush to remove foreign matter on the surface. Personnel in all processes must wear gloves, and must perform degreasing work before and after lamination.