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Multilayer circuit board factory: How to deal with the problem of multilayer circuit board lamination process

Multilayer circuit board factory: How to deal with the problem of multilayer circuit board lamination process

  • Categories:Industry News
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  • Time of issue:2020-07-08 13:35
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Multilayer circuit board factory: How to deal with the problem of multilayer circuit board lamination process

Information

 

Parameters such as the total thickness and number of layers of the multilayer circuit board are limited by the characteristics of the board. Special plates generally have a limited variety of plates with different thicknesses, so the designer should consider the characteristic parameters and the limitations of the processing technology of the multilayer circuit board in the process of multi-layer circuit board design.


As the name implies, the laminated multilayer circuit board is a process of bonding each layer of circuit pieces to form a whole. The whole process includes kiss pressure, full pressure, and cold pressure. In the kiss-pressing stage, the resin infiltrates the bonding surface, fills the gaps in the line, enters all the pressure, and bonds all the gaps. Cold pressing is to quickly cool the circuit board and keep the size stable. Pay attention to the three major issues of temperature, pressure and time when making laminates. Mainly pay attention to the melting and hardening temperature of the resin, the setting temperature of the hot plate, the actual temperature of the material and the temperature change, etc. Under pressure, the basic principle is to fill the interlayer cavity with resin to discharge interlayer gas and volatile substances. Time parameters mainly include pressure time control, heating time control, gel time and so on.

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When a multilayer circuit board lamination process problem occurs, the first thing to consider is to integrate this problem into the process specifications of the multilayer circuit board, and gradually enrich our technical specifications. When a certain amount is reached, the quality will change. Most of the quality problems that occur in the lamination process of multi-layer circuit boards are generally caused by the supplier's raw materials or different lamination loads. However, only a small number of customers can have the corresponding data records, so if most customers can predict the stability and continuity of the quality control of the multilayer circuit board lamination in advance, a lot of losses can be avoided.


The most effective way to solve the problem at present is to inspect the unqualified copper layer on the surface, it is recommended to use hydrochloric acid, and then use a machine brush to remove foreign matter on the surface. Personnel in all processes must wear gloves, and must perform degreasing work before and after lamination.

 

Keyword:

The evaluation system of the circuit board factory should follow the following principles

The evaluation system of the circuit board factory should follow the following principles

Establishing a good cooperative relationship with circuit board factories is conducive to cost reduction, response time reduction and the creation of new market value, etc. The core issue is how to choose the ideal circuit board factory. There are many factors involved in the evaluation of circuit board factories, and the evaluation index systems are diverse, both qualitative and quantitative, and the index weights are also different. Therefore, it is necessary to establish a universal and expandable evaluation index system for circuit board factories. , And the indicator system should follow the following principles:
The use of soft and hard circuit boards?

The use of soft and hard circuit boards?

In our daily life, circuit boards are mostly single-sided, double-sided, or multi-layer boards, rigid boards, metal-based circuit boards, aluminum, copper substrates, thermally conductive fiberboards, etc., do you know what a flexible and rigid circuit board is? Rigid-flex circuit board: refers to a special circuit board made by pressing a rigid circuit board (PCB) and a flexible circuit board (FPC). The main board materials used are rigid board FR4 and flexible board polyimide (PI). Rigid and flexible circuit boards combine the rigid characteristics of rigid circuit boards and the advantages of flexible circuit
Soft and hard circuit board production process

Soft and hard circuit board production process

The flexible and hard circuit board is the flexible circuit board and the rigid circuit board. After pressing and other processes, they are combined according to the relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. In the past, two hard boards were connected by using soft boards and connectors to connect each other. In order to improve the reliability of the connection between the rigid board and the flexible board, the flexible board is directly fabricated between two rigid boards in the printed circuit board (PCB) factory, which can avoid the subsequent connection process, whether it is a rigid board manufacturer or FPC manufacturers are now able to supply rigid-flex boards. Under the demand for light and thin end products, the

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