Multi-layer circuit board factory: multi-layer circuit board lamination process problem processing method
multi-layer circuit board laminated total thickness and number of layers and other parameters are limited by the characteristics of the board. Special plates generally have limited varieties of plates with different thicknesses, so designers should consider the limitations of characteristic parameters and processing technology of multilayer circuit boards in the design process of multilayer circuit boards.
As the name implies, laminating multi-layer circuit board is a process of forming a whole by bonding the circuit sheets of each layer. The whole process, including kiss pressure, full pressure, cold pressure. In the kissing stage, the resin infiltrates the bonding surface, fills the gaps in the line, enters the full pressure, and bonds all gaps. Cold pressing is to cool the circuit board quickly and keep the size stable. When making laminates, pay attention to the three major issues of temperature, pressure and time. The main attention is paid to the melting and hardening temperature of the resin, the hot plate setting temperature, the actual temperature of the material and temperature changes, etc. Under pressure, the basic principle is to fill the interlayer cavity with resin and discharge interlayer gas and volatile substances. Time parameters mainly include pressure time control, heating time control, gel time, etc.
When the lamination process problem of multilayer circuit board occurs, the first thing to consider is to integrate this problem into the process specifications of multilayer circuit board , and gradually enrich our Technical specifications, when a certain amount is reached, the quality will change. multi-layer circuit board lamination process quality problems, mostly in the supplier's raw materials or different lamination load quality problems. However, only a few customers can have the corresponding data records, so if most customers can predict the quality control stability and continuity of lamination of multilayer circuit board in advance, many losses can be avoided.
At present, the more effective method to solve the problem is to check the unqualified copper layer on the surface, it is recommended to use hydrochloric acid, and then use the method of machine brush to remove the foreign matter on the surface. Personnel in all processes must wear gloves and must be treated to remove oil stains before and after lamination.
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