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8-layer 1-stage blind buried via board Blind buried via circuit board Rigid and flexible circuit board

8-layer 1-stage blind buried via board Blind buried via circuit board Rigid and flexible circuit board

Number of layers: 8 layers (1+6+1) Board thickness: 1.0MM Minimum line width and distance: 2MIL Minimum through hole: 0.2MM The smallest blind hole: 0.1MM Surface treatment: Immersion gold Application field car
Product serial number
Category
HDI Board
Product description
Parameters

Number of layers: 8 layers (1+6+1)
Board thickness: 1.0MM
Minimum line width and distance: 2MIL
Minimum through hole: 0.2MM
The smallest blind hole: 0.1MM
Surface treatment: Immersion gold


Application field
car

Keyword:
layers
hole
minimum
through
treatment
blind
distance
thickness
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