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8-layer 1-stage blind buried via board Blind buried via circuit board Rigid and flexible circuit board
Product serial number
Category
HDI Board
Product description
Parameters
Number of layers: 8 layers (1+6+1)
Board thickness: 1.0MM
Minimum line width and distance: 2MIL
Minimum through hole: 0.2MM
The smallest blind hole: 0.1MM
Surface treatment: Immersion gold
Application field
car
Keyword:
layers
hole
minimum
through
treatment
blind
distance
thickness
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Fax:86-755-27691537
Mail:csaa@hengkepcb.com
Address:No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province
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