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8-layer 1-stage blind buried via board Blind buried via circuit board Rigid and flexible circuit board
Product serial number
Category
HDI Board
Product description
Parameters
Number of layers: 8 layers (1+6+1)
Board thickness: 1.0MM
Minimum line width and distance: 2MIL
Minimum through hole: 0.2MM
The smallest blind hole: 0.1MM
Surface treatment: Immersion gold
Application field
car
Keyword:
layers
hole
minimum
through
treatment
blind
distance
thickness
产品中心
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Number of floors: 16 floors Board thickness: 2.0MM Minimum line width and distance: 4MIL/4MIL Minimum through hole: 0.25MM Surface treatment: Immersion gold Application field Security equipment16-layer board Multi-layer circuit board Multi-layer circuit board factory Multi-layer circuit board0.00Number of floors: 16 floors Board thickness: 2.0MM Minimum line width and distance: 4MIL/4MIL Minimum through hole: 0.25MM Surface treatment: Immersion gold Application field Security equipment -
Number of floors: 12 floors Board thickness: 1.6MM Minimum line width and line spacing: 3MIL/4MIL Minimum through hole: 0.2MM Distance from hole to line: 7MIL Surface treatment: Immersion gold Application field communication device12-layer board Multi-layer circuit board Multi-layer circuit board Multi-layer printed circuit board0.00Number of floors: 12 floors Board thickness: 1.6MM Minimum line width and line spacing: 3MIL/4MIL Minimum through hole: 0.2MM Distance from hole to line: 7MIL Surface treatment: Immersion gold Application field communication device -
Number of floors: 10 floors Board thickness: 1.6MM Minimum line width and line spacing: 3MIL/4MIL Minimum through hole: 0.2MM Surface treatment: Immersion gold Application field: medical equipment10-layer board Multi-layer circuit board Soft-hard combined circuit board Multi-layer circuit board0.00Number of floors: 10 floors Board thickness: 1.6MM Minimum line width and line spacing: 3MIL/4MIL Minimum through hole: 0.2MM Surface treatment: Immersion gold Application field: medical equipment
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描述：
National Service Hotline：
86-755-29615096
Fax：86-755-27691537
Mail：csaa@hengkepcb.com
Address：No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province
Copyright: Shenzhen Hengkesheng Electronics Co., Ltd. 备案号：粤ICP备08029233号
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