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Any layer of high-density interconnection board Multi-layer circuit board Multi-layer circuit board factory
Product serial number
Category
HDI Board
Product description
Parameters
Number of layers: 10 layers (4+2+4)
Board thickness: 1.0MM
Minimum line width and distance: 2.5MIL
Minimum through hole: 0.2MM
The smallest blind hole: 0.1MM
Surface treatment: Immersion gold
Application field
Microcomputer
Keyword:
layers
hole
minimum
through
treatment
blind
2.5mil
distance
thickness
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Fax:86-755-27691537
Mail:csaa@hengkepcb.com
Address:No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province
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