Arbitrary Layer High Density Interconnect Board Multilayer Circuit Board Multilayer Circuit Board Factory
Number of layers: 10 layers (42 4) plate thickness: 1.0MM minimum line width line spacing: 2.5MIL minimum through hole: 0.2MM minimum blind hole: 0.1MM surface treatment: microcomputer in gold sinking application field
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Commodity Description
layer number: 10 layers (4 2 4)
plate thickness: 1. 0MM
minimum line width line spacing: 2.5MIL
minimum through hole: 0. 2MM
minimum blind hole: 0. 1MM
surface treatment: gold sink
application field
microcomputer
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