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10-layer 2-step blind buried via board Blind buried via circuit board HDI circuit board

10-layer 2-step blind buried via board Blind buried via circuit board HDI circuit board

Number of layers: 10 layers (2+6+2) Board thickness: 1.2MM Minimum line width and distance: 2.5MIL Minimum through hole: 0.2MM The smallest blind hole: 0.1MM Surface treatment: Immersion gold Application field POS machine
Product serial number
Category
HDI Board
Product description
Parameters

Number of layers: 10 layers (2+6+2)
Board thickness: 1.2MM
Minimum line width and distance: 2.5MIL
Minimum through hole: 0.2MM
The smallest blind hole: 0.1MM
Surface treatment: Immersion gold


Application field
POS machine

Keyword:
layers
hole
minimum
through
treatment
blind
2.5mil
distance
thickness
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