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10-layer 2-step blind buried via board Blind buried via circuit board HDI circuit board
Product serial number
Category
HDI Board
Product description
Parameters
Number of layers: 10 layers (2+6+2)
Board thickness: 1.2MM
Minimum line width and distance: 2.5MIL
Minimum through hole: 0.2MM
The smallest blind hole: 0.1MM
Surface treatment: Immersion gold
Application field
POS machine
Keyword:
layers
hole
minimum
through
treatment
blind
2.5mil
distance
thickness
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Fax:86-755-27691537
Mail:csaa@hengkepcb.com
Address:No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province
Copyright: Shenzhen Hengkesheng Electronics Co., Ltd. 备案号:粤ICP备08029233号
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