Analysis of pcb factory automation and industrial planning
PCB factory automation is an important means to improve the company's profitability, but many PCB factories have misunderstandings about the choice of automation equipment. Many pcb factory decision makers think that automation equipment is a substitute, can only replace labor in one place, without considering the transportation and connectivity between process routes. For example, after electroplating, a simple polisher is added to the processing line (considering the equipment price), the polishing board is a simple flat vehicle, and the current product structure chain of the pcb factory enterprise itself is not suitable for automation equipment. At present, many customers with a production capacity of less than 20000 square meters have complex product structures, many varieties and specifications, different plate thicknesses and sizes, and most of them have small capacities. In the same period, one plate has the possibility of multiple specifications. This puts a great test on the requirements of automation equipment.
At present, the initial design and deployment plan of many PCB factories is unreasonable. Many businesses now think so. First determine the location of all the main equipment, determine the horizontal line and other equipment, and then do a good job of room layout, if there is an automated location, select the above automation equipment. Otherwise, select manual operation. In fact, the correct thing is to select a reasonable main equipment process according to the site, the planning of automation equipment, the logistics direction of the vehicle, and the separation of rooms to make the equipment logistics smooth. The future main business of the factory is uncertain, and the equipment fluctuation caused by the uncertainty of the process of using the equipment also brings great instability to the configuration of automation equipment. At present, many equipment manufacturers and enterprises are vigorously developing industrial 4.0 equipment in order to quickly occupy the market, which has reached the purpose of publicity and preconceptions. Many enterprises are also looking forward to achieving the desired results through the intelligent transformation of factories.
However, we can still work in this direction. With the stability of the equipment and the continuous optimization of the plan, it is possible for the subsequent factories to achieve intelligence. With this in mind, combined with automation equipment, some suggestions are made for businesses looking to build plans for future automation equipment and smart factories.
1) Determine the main product process, reasonable arrangement of process and automation equipment coordination.
2) The selection of automation equipment takes into account the connection between the processes, reducing product defects and manual workload caused by unnecessary vehicle replacement.
3) Reasonable design capability phased plan to reduce the inconvenience caused by intelligent AGV logistics vehicles.
4) Use the current new technology equipment to ensure that the automation matching is more smoothly connected. 5) Through the docking of ERP data and field equipment parameters in the factory, reasonable process adjustment is realized.
6) The parameters of the product process are more effectively communicated and executed on site.
7) Combined with electrical equipment, redesign the interior of the factory to achieve semi-automatic and full automation.
8) Improve the understanding of modern intelligent factories and automation equipment enterprises, according to their own conditions to achieve a truly reasonable automation plan.
pcb factory
The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
2023-07-28
The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
2023-07-28
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
2023-07-28
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
2023-07-28
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.