thick copper circuit board preparation before plating and plating treatment. The main purpose of thick copper plating is to ensure that there is a thick enough copper coating in the hole to ensure that the resistance value is within the range of process requirements. As a plug-in, it is fixed in place to ensure the connection strength; as a surface packaging device, some holes are only used as vias, which play the role of conduction on both sides.

inspection items. Mainly check the metallization quality status of the hole to ensure that there are no redundant objects, burrs, black holes, holes, etc. In the hole; Check whether there is dirt and other unnecessary objects on the surface of the substrate; Check the serial number, drawing number, process documents and process description of the substrate; Find out the installation position, installation requirements and plating area that the plating tank can bear; The electroplating area and process parameters should be clear to ensure the stability and feasibility of the electroplating process parameters; Clean the conductive part and prepare it. First, power on to make the solution active; determine whether the composition of the bath is qualified and the surface area of the polar plate; if the spherical anode is installed on the column, the consumption must also be checked. Check the firmness of the contact part and the fluctuation range of voltage and current.
circuit board factory, multilayer circuit board factory, Shenzhen circuit board factory remind you, thick copper circuit board quality control. Accurately calculate the plating area and refer to the influence of the actual production process on the current, correctly determine the required value of the current, master the change of the current in the plating process, and ensure the stability of the plating process parameters; Before electroplating, use the debugging board to test the plating to make the plating solution in an active state. Determine the flow direction of the total current, and then determine the order of hanging plates. In principle, it is adopted from far to near. To ensure the uniformity of current distribution on any surface; In order to ensure the uniformity of the coating in the hole and the consistency of the coating thickness, pulse current should be used in addition to stirring, filtering and other process measures. Regularly monitor the change of current in the electroplating process to ensure the reliability and stability of the current value; Check whether the thickness of the copper plating layer in the hole meets the technical requirements.
thick copper circuit board process. In the process of thickening copper plating, the process parameters must be monitored frequently, which often leads to unnecessary losses due to subjective and objective reasons. To do a good job of thickening copper plating, the following points must be done: according to the area value calculated by the computer and combined with the experience constant accumulated in actual production, increase a certain value; According to the calculated current value, in order to ensure the integrity of the coating in the hole, it is necessary to increase a certain value on the basis of the original current value, I .e. pulse current, and then return to the original value in a short time. When the circuit board is electroplated for 5 minutes, take out the substrate to observe whether the copper layer on the surface and the inner wall of the hole is complete, preferably all holes are metal; a certain distance must be maintained between the substrates; when the thick copper plating reaches the required plating time, a certain current should be maintained during the removal of the substrate to ensure that the subsequent substrate surface and hole will not turn black or dark.
Circuit Board Factory, Multilayer Circuit Board Factory and Shenzhen Circuit Board Factory tell you the precautions for thick copper circuit boards: check the process documents, read the process requirements, and be familiar with the blueprint for substrate processing; Check the surface of the substrate for scratches, indentations, exposed copper parts, etc. According to the processing floppy disk for trial processing, pre-check the first piece, and then process all workpieces according to the process requirements; Prepare measuring tools and other tools for monitoring the geometric dimensions of the substrate; depending on the nature of the raw material from which the substrate is processed, a suitable milling tool (milling cutter) is selected.