What are the basic components of a multilayer circuit board?
is composed of two or more conductive layers stacked on each other, so the manufacturing process is relatively complicated. Do you know what the basic components of multilayer circuit boards are? Today's editor will take you to understand. 1. Mechanical layer
The mechanical layer is an accessory with information about plate making and preparation methods. It can draw the boundary of the circuit board when using the multilayer board, and place better processing technology to achieve simple page planning. The
mechanical layer also makes the process connection more vivid. 2. Internal power supply layer
The signal layer and the internal power supply layer on the multi-layer circuit board
are connected to each other through holes to achieve better electronic operation capabilities, and the internal power supply layer is a unique accessory. In the case of using this internal power layer, better connection can be achieved. 3. signal layer
multi-layer circuit board
to realize information exchange, it is important to have three signal layers. The components and signal lines are placed on the multilayer circuit board by soldering, so that the multilayer circuit board can realize the normal information service function. In the case of using this information layer, the multi-layer circuit board has good information interaction capabilities, and can achieve better electronic control capabilities. Shenzhen Hengke Sheng Electronics Co., Ltd. is a new high-tech enterprises. As a professional multilayer circuit board factory, the main products are
multilayer circuit board , HDI board proofing, HDI circuit board, blind buried hole circuit board, soft and hard combination circuit board, pcb circuit board proofing, ceramic circuit board, High density connection board, multilayer printed circuit board, etc. Specially for domestic and foreign high-tech enterprises and scientific research units to provide superior fast service. Hengkesheng Electronics is a private science and technology enterprise recognized by Shenzhen Science and Technology Bureau. At the same time, the company strives together to create excellent culture and excellent enterprises in the process of development. Adhere to the spirit of perseverance, and constantly absorb international emerging technologies. Improve product quality and exceed customer needs.
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The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
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The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
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Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
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In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
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Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
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