The reason why the production of multilayer circuit boards is not closed.
raw materials is the basic quality guarantee of
multi-layer circuit board . If the quality of raw materials of circuit board is not up to standard, the produced circuit board will have bubbles, warping and uneven thickness. 2. The circuit board production process is unqualified. Each process in the
production process must strictly implement the production process, and each process must be equipped with corresponding test equipment to ensure the stable quality of the
multilayer circuit board . Many circuit board factories because the production technology does not meet the standards, the produced circuit boards are sold at a lower price. If this circuit board is put into use, it is prone to various problems. 3. The circuit board production equipment does not meet the standards.
With the development of science and technology,
multi-layer circuit board production equipment is updated faster and faster, and the price is becoming more and more expensive. The fundamental way to improve the quality of the circuit board is to ensure the quality of the equipment from the hardware, increase the investment in the equipment, and make the equipment run stably. Therefore, some small circuit board factories cannot purchase expensive equipment, resulting in the production of multilayer circuit board does not meet the production requirements. Shenzhen Hengke Sheng Electronics Co., Ltd. is a new high-tech enterprises. As a multilayer circuit board factory, the main products are
multilayer circuit board , HDI board proofing, HDI circuit board, blind buried hole circuit board, soft and hard combination circuit board, pcb circuit board proofing, ceramic circuit board, High density connection board, multilayer printed circuit board, etc. Specially for domestic and foreign high-tech enterprises and scientific research units to provide superior fast service. Hengkesheng Electronics has been selected as the annual outstanding supplier of many well-known enterprises at home and abroad. It is a private technology enterprise recognized by the Shenzhen Municipal Science and Technology Bureau. At the same time, the company has worked together in the development process and is committed to creating excellent culture and excellent enterprises. Adhere to the spirit of perseverance, and constantly absorb international emerging technologies. Improve product quality and exceed customer needs.
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The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
2023-07-28
The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
2023-07-28
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
2023-07-28
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
2023-07-28
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
National Service Hotline:
Shenzhen Hengke Sheng Electronics Co.
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Fax: 86-755-27691537
Mailbox: csaa@hengkepcb.com
Website: www.hengkepcb.com
Address: No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province
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