Blind buried hole circuit board: high precision circuit board explanation
With the development of electronic products to high density and high precision, the same requirements are also put forward for circuit boards. The most effective way to increase the density of the PCB blind hole circuit board is to reduce the number of through holes, and accurately set the blind holes and buried holes to meet this requirement, thereby forming the HDI board.
HDI blind buried hole circuit board is a compact product designed for small capacity users. It adopts modular and parallel design. One module has a capacity of 1000VA(1U height) and has been naturally cooled. It can be placed directly in a 19-inch rack, and up to 6 modules can be connected in parallel. The product uses full digital signal process control (DSP) technology and a number of A patent technology, regardless of the load power factor and crest factor, has a comprehensive adaptive load capacity and strong short-term overload capacity.
HDI blind buried circuit board is mainly manufactured using micro blind hole and buried via hole technology. It is characterized in that the electronic circuits in the printed circuit board can be distributed with higher circuit density, and because of the large increase in circuit density, the printed circuit board made of the HDI board cannot be used. Typically, for drilling, HDI must employ a non-mechanical drilling process. There are many non-mechanical drilling methods. Among them, "laser drilling" is the main hole forming solution for HDI high-density interconnection technology.
HDI blind-buried circuit boards are usually manufactured by stacking methods. The longer the setup time, the higher the technical level of the circuit board. It can reduce the cost of PCB blind hole circuit board: when the density of PCB increases to more than eight layers, it is manufactured with HDI blind hole circuit board, and its cost will be lower than the traditional complex pressing process.
Blind buried hole circuit board
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