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Blind and buried via circuit board: high-precision circuit board explanation

Blind and buried via circuit board: high-precision circuit board explanation

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  • Time of issue:2020-08-27 15:31
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Blind and buried via circuit board: high-precision circuit board explanation

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With the development of electronic products to high density and high precision, the same requirements are put forward on circuit boards. The most effective way to increase the density of PCB blind and buried vias is to reduce the number of vias, and accurately set blind and buried vias to meet this requirement, thus forming an HDI board.


  HDI blind buried via circuit board is a compact product designed for small-capacity users. It adopts modular and parallel design. A module has a capacity of 1000VA (1U height) and has been naturally cooled. It can be placed directly in a 19-inch rack, and up to 6 modules can be connected in parallel. The product adopts all-digital signal process control (DSP) technology and a number of patented technologies. Regardless of the load power factor and crest factor, it has a comprehensive adaptive load capacity and a strong short-term overload capacity.


  HDI blind buried vias are mainly manufactured using blind micro vias and buried via technology. It is characterized in that the electronic circuits in the printed circuit board can be distributed with a higher circuit density, and the printed circuit board made of HDI board cannot be used due to the large increase in circuit density. Generally, for drilling, HDI must use a non-mechanical drilling process. There are many non-mechanical drilling methods. Among them, "laser drilling" is the main hole-forming solution for HDI high-density interconnection technology.


  HDI blind buried vias are usually manufactured by stacking methods. The longer the build time, the higher the technical level of the circuit board. It can reduce the cost of PCB blind buried vias: when the density of PCB increases to more than eight layers, it is manufactured with HDI blind buried vias, and its cost will be lower than the traditional complex pressing process.

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The evaluation system of the circuit board factory should follow the following principles

The evaluation system of the circuit board factory should follow the following principles

Establishing a good cooperative relationship with circuit board factories is conducive to cost reduction, response time reduction and the creation of new market value, etc. The core issue is how to choose the ideal circuit board factory. There are many factors involved in the evaluation of circuit board factories, and the evaluation index systems are diverse, both qualitative and quantitative, and the index weights are also different. Therefore, it is necessary to establish a universal and expandable evaluation index system for circuit board factories. , And the indicator system should follow the following principles:
The use of soft and hard circuit boards?

The use of soft and hard circuit boards?

In our daily life, circuit boards are mostly single-sided, double-sided, or multi-layer boards, rigid boards, metal-based circuit boards, aluminum, copper substrates, thermally conductive fiberboards, etc., do you know what a flexible and rigid circuit board is? Rigid-flex circuit board: refers to a special circuit board made by pressing a rigid circuit board (PCB) and a flexible circuit board (FPC). The main board materials used are rigid board FR4 and flexible board polyimide (PI). Rigid and flexible circuit boards combine the rigid characteristics of rigid circuit boards and the advantages of flexible circuit
Soft and hard circuit board production process

Soft and hard circuit board production process

The flexible and hard circuit board is the flexible circuit board and the rigid circuit board. After pressing and other processes, they are combined according to the relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. In the past, two hard boards were connected by using soft boards and connectors to connect each other. In order to improve the reliability of the connection between the rigid board and the flexible board, the flexible board is directly fabricated between two rigid boards in the printed circuit board (PCB) factory, which can avoid the subsequent connection process, whether it is a rigid board manufacturer or FPC manufacturers are now able to supply rigid-flex boards. Under the demand for light and thin end products, the

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