Multi-layer circuit boards: Why can't you touch them directly with your hands?
Why can't you touch the multi-layer circuit board directly with your fingers? What are the serious consequences if you touch the circuit board directly with your hands? In fact, this will lead to the scrapping of the multi-layer circuit board and reduce the reliability of the end user. However, it is inevitable to directly touch the multilayer circuit board by hand during operation. Therefore, it is necessary to develop the habit of wearing gloves, which can reduce direct contact with multilayer circuit boards. circuit board hazards. The editor below will walk everyone through the causes, hazards, and how to avoid fingerprints that can cause damage to multilayer boards.
1. Fingerprints: Fingerprints are sweat stains on your hands. Its main components are water, inorganic salts, fatty oils and various pollutants, such as cosmetics and skin care products.
2. The hazards of fingerprints in the manufacturing process of multi-layer circuit boards:
3. Bare hands touching the circuit board before the solder resist will cause the solder resist to fall, resulting in poor adhesion of oil, and it will bubble and fall during the hot air leveling process;
4. In the process from the solder resist to the package, bare hands touching the surface of the multi-layer circuit board will cause the surface of the circuit board to be unclean and cause poor solderability or poor;
5. The bare object contacts the circuit board in a short time, which causes the copper to chemically react on the surface of the board, which causes the copper surface to oxidize. After a long time, obvious fingerprints will appear after electroplating, and the uneven coating will cause serious defects in the appearance of the product;
6. The wet film or silk screen circuit before printing and the surface of the circuit board before lamination are covered with fingerprint grease. It is easy to reduce the adhesion of the dry/wet film, and cause the penetration and separation of the coating during the electroplating process. Therefore, gold plating is easy to cause the solder mask on the surface of the circuit board, the pattern will oxidize the surface of the circuit board and appear in both negative and positive colors.
If the above phenomenon is not eliminated, it will damage the pass rate and one-time pass rate of multi-layer circuit boards, resulting in a longer production and processing cycle, a higher rework rate and a lower on-time delivery rate.
multilayer circuit board
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