Description of the role of blind buried hole circuit board
blind-hole board is connected to the adjacent inner layer through plated holes. Because you can't see the other side, it's called "blind". In order to increase the space utilization of the PCB circuit layer, the "blind hole" process came into being. This production method requires special attention to the depth of the drilling (Z axis) to be just right. This method often causes difficulties in plating in the holes, so few manufacturers use it; it is also possible to place circuit layers that need to be connected in advance on each circuit layer. When it takes time, drill holes first and then stick them together, but a relatively accurate positioning and alignment device is required.
The blind-buried circuit board is located on the top and bottom surfaces of the printed circuit board, and has a certain depth for the connection between the surface layer and the underlying inner layer. The depth of the hole usually does not exceed a certain proportion (diameter).
In non-through-hole technology, the application of blind-buried circuit boards and buried holes can greatly reduce the size and quality of blind-hole and buried-hole circuit boards, reduce the number of layers, improve electromagnetic compatibility, and increase electronic products Features and reduce costs. Make design work easier and faster. In traditional PCB design and processing, there are many problems with through holes. First, they occupy a lot of effective space, and secondly, a large number of through holes are densely crowded in one place, which also poses a huge obstacle to the inner layer wiring of the multi-layer PCB. These vias occupy the space required for wiring, and they pass through the power and ground densely. The surface of the line layer will also destroy the impedance characteristics of the power ground layer, so that the power ground layer failure. The workload of traditional mechanical drilling will be 20 times that of non-penetrating hole technology.
In PCB design, although the size of pads and vias has been gradually reduced, if the thickness of the board layer is not reduced proportionally, the aspect ratio of the via will increase, and the increase in the aspect ratio of the via will Reduce reliability. With the maturity of advanced laser drilling technology and plasma dry etching technology, it is possible to apply non-penetrating blind buried hole circuit boards and small buried holes. If the diameter of these non-penetrating holes is 0.3mm, the parasitic parameters they bring are about 1/10 of the original conventional holes, thus improving the reliability of PCB.
Through holes are just holes drilled or plated on the PCB, which allow signals to pass to the inner layer of the circuit board or the other side of the circuit board. Vias typically connect component leads to planes or signal traces. These allow the signal layer to be changed. If the through hole completely passes through the PCB board, it is usually called a through hole. You may also hear people refer to it as a through hole. Blind buried via boards and buried vias are only available on boards with at least four layers. They connect the inner layer to other inner layers of its adjacent or adjacent surface layer.
Due to the use of non-through hole technology, there will be few large vias on the blind buried hole circuit board and the buried hole circuit board, thus providing more space for the routing. The remaining space can be used for large area shielding to improve EMI/RFI performance. At the same time, the inner layer can also use more remaining space to partially shield equipment and key network cables to make them have electrical properties. The use of non-through holes makes it easier to fan out the device pins, facilitates the wiring of high-density pin devices (such as BGA package devices), shortens the wiring length, and meets the timing requirements of high-speed circuits.
Blind buried hole circuit board
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