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12-layer 3-layer blind buried vias Multi-layer PCB Multi-layer PCB factory

12-layer 3-layer blind buried vias Multi-layer PCB Multi-layer PCB factory

Number of floors: 12 floors (3+6+3) Board thickness: 1.2MM Minimum line width and distance: 2.5MIL/3MIL Minimum through hole: 0.2MM The smallest blind hole: 0.1MM Surface treatment: Immersion gold Application field supercomputer
Product serial number
Category
HDI Board
Product description
Parameters

Number of floors: 12 floors (3+6+3)
Board thickness: 1.2MM
Minimum line width and distance: 2.5MIL/3MIL
Minimum through hole: 0.2MM
The smallest blind hole: 0.1MM
Surface treatment: Immersion gold


Application field
supercomputer

Keyword:
floors
hole
minimum
through
treatment
supercomputer
blind
2.5mil
distance
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