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12-layer 3-layer blind buried vias Multi-layer PCB Multi-layer PCB factory
Product serial number
Category
HDI Board
Product description
Parameters
Number of floors: 12 floors (3+6+3)
Board thickness: 1.2MM
Minimum line width and distance: 2.5MIL/3MIL
Minimum through hole: 0.2MM
The smallest blind hole: 0.1MM
Surface treatment: Immersion gold
Application field
supercomputer
Keyword:
floors
hole
minimum
through
treatment
supercomputer
blind
2.5mil
distance
产品中心
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National Service Hotline：
86-755-29615096
Fax：86-755-27691537
Mail：csaa@hengkepcb.com
Address：No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province
Copyright: Shenzhen Hengkesheng Electronics Co., Ltd. 备案号：粤ICP备08029233号
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