12-layer 3-step blind buried hole plate multilayer circuit board multilayer circuit board factory
Number of layers: 12 layers (363) plate thickness: 1.2MM minimum line width line spacing: 2.5MIL/3MIL minimum through hole: 0.2MM minimum blind hole: 0.1MM surface treatment: supercomputer in gold sinking application field
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Commodity Description
Layer: 12 Layer (363)
Plate Thickness: 1. 2MM
Minimum Line Width Line Distance: 2.5MIL/3MIL
Minimum Through Hole: 0. 2MM
Minimum Blind Hole: 0. 1MM
Surface Treatment: Gold
Application Field
Supercomputer
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