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12-layer 3-step blind buried hole plate multilayer circuit board multilayer circuit board factory

Number of layers: 12 layers (363) plate thickness: 1.2MM minimum line width line spacing: 2.5MIL/3MIL minimum through hole: 0.2MM minimum blind hole: 0.1MM surface treatment: supercomputer in gold sinking application field


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Layer: 12 Layer (363)
Plate Thickness: 1. 2MM
Minimum Line Width Line Distance: 2.5MIL/3MIL
Minimum Through Hole: 0. 2MM
Minimum Blind Hole: 0. 1MM
Surface Treatment: Gold

Application Field
Supercomputer

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