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4-layer 1-step blind buried via half-hole board Blind buried via circuit board Multilayer circuit board factory
Product serial number
Category
HDI Board
Product description
Parameters
Number of layers: 4 layers (1+2+1)
Board thickness: 0.8MM
Minimum line width and distance: 3MIL/3.5MIL
Minimum through hole: 0.2MM
The smallest blind hole: 0.1MM
Surface treatment: Immersion gold
Application field
Bluetooth module
Keyword:
layers
hole
minimum
through
treatment
blind
distance
thickness
line
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86-755-29615096
Fax:86-755-27691537
Mail:csaa@hengkepcb.com
Address:No.253, Nanpu Road, Shajing Street, Baoan District, Shenzhen City, Guangdong Province
Copyright: Shenzhen Hengkesheng Electronics Co., Ltd. 备案号:粤ICP备08029233号
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