4-layer 1-step blind buried hole half-hole plate blind buried hole circuit board multilayer circuit board factory
Number of layers: 4 layers (12 1) plate thickness: 0.8MM minimum line width line spacing: 3MIL/3.5MIL minimum through hole: 0.2MM minimum blind hole: 0.1MM surface treatment: Bluetooth module for gold sinking applications
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Commodity Description
Layer: 4 Layer (121)
Plate Thickness: 0. 8MM
Minimum Line Width Line Distance: 3MIL/3.5MIL
Minimum Through Hole: 0. 2MM
Minimum Blind Hole: 0. 1MM
Surface Treatment: Shen Jin
Application Field
Bluetooth Module
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