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4-layer 1-step blind buried via half-hole board Blind buried via circuit board Multilayer circuit board factory

4-layer 1-step blind buried via half-hole board Blind buried via circuit board Multilayer circuit board factory

Number of layers: 4 layers (1+2+1) Board thickness: 0.8MM Minimum line width and distance: 3MIL/3.5MIL Minimum through hole: 0.2MM The smallest blind hole: 0.1MM Surface treatment: Immersion gold Application field Bluetooth module
Product serial number
Category
HDI Board
Product description
Parameters

Number of layers: 4 layers (1+2+1)
Board thickness: 0.8MM
Minimum line width and distance: 3MIL/3.5MIL
Minimum through hole: 0.2MM
The smallest blind hole: 0.1MM
Surface treatment: Immersion gold


Application field
Bluetooth module

Keyword:
layers
hole
minimum
through
treatment
blind
distance
thickness
line
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