The evaluation system of circuit board factory should follow the following principles
circuit board factory involves many factors, and the evaluation index system is diverse, both qualitative and quantitative, and the weight of the index is also different. Therefore, it is necessary to establish a general and expandable evaluation index system of circuit board factory, and the index system should follow the following principles:
principle of completeness and simplicity
on the premise that the information of circuit board factory is as sufficient as possible, the number of selected indicators should be as few as possible, concise and clear, there should be no strong correlation between the indicators, and there should be no excessive information inclusion and coverage that would overlap the content of the indicators.
Principle of objectivity and comparability
The selection process of indicators should be as free from subjective factors as possible, qualitative indicators are greatly influenced by subjective factors and are prone to understanding bias, while quantitative indicators are easy to quantify and measure, so quantitative indicators should be selected as much as possible.
Reconfigurable and Extendibility Principle
The evaluation index system should not only change in quantity, but also change in content. Users can modify, add and delete the index system according to different requirements, and further specify the evaluation index according to the specific situation.
Risk zui Minimization Principle
Supply chain operation has certain risks. Risk issues must be carefully considered to avoid or reduce the overall operation risks of the supply chain.
Violation of the above principles will greatly affect the efficiency of the supply chain. Violating the principle of core competence and total cost, it is difficult to meet the requirements of the "external economy" of the supply chain, violating the principle of agility, can not guarantee the purpose of quickly catering to market opportunities, while ignoring the principle of risk zui reduction, will lay a huge hidden danger for the operation of the supply chain. Therefore, when choosing a circuit board factory, the above four basic principles must be fully and seriously considered. The establishment of the evaluation index system of
circuit board factory The evaluation and selection of
circuit board factory is complicated due to its many influencing factors. According to the three major factors followed by the evaluation index system of circuit board factory, the evaluation and selection of indicators that are easy to measure and easy to collect data are selected. The evaluation of circuit board factory should refer to nine index systems:
product quality, product price and after-sales service, geographical location, technical level, supply capacity, economic efficiency, delivery, market impact.
circuit board factory
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The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
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The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
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Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
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In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
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Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
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