Blind and buried via circuit boards are also called HDI boards and are usually used in mobile phones, GPS navigation and other high-end products. The structure of a conventional multi-layer circuit board includes an inner layer circuit and an outer layer circuit, and then a process of drilling and metallization in the hole is used to realize the connection function between the inner layers of the circuits. With the development of electronic products to high density and high precision, the same requirements are put forward for circuit boards.

It is difficult to copy boards for blind buried vias. Usually, blind buried vias are encountered when copying boards on mobile phone boards and HDI boards. At this time, please pay attention to the following points:

1. Please be careful and be prepared before copying the board.

2. The equipment must be advanced.

3. In the process of copying the board, compare it with the original board.

4. Pay attention to check and check repeatedly.

In order to ensure the working conditions and reduce the failure rate of the circuit board, we need to maintain the blind buried via circuit board. The maintenance method can be divided into semi-maintenance and annual maintenance.

1. Semi-maintenance

(1) Clean the dust on the blind and buried via circuit boards quarterly. It can be cleaned with a special cleaning fluid for the circuit board. After the dust on the blind buried via circuit board is cleaned up, use a blower to dry it.

(2) Observe whether the electronic components on the blind buried via circuit board have high temperature traces and whether the electrolytic capacitors are bulging and leaking. If problems are found during the inspection process, they should be replaced in time.

2. Annual maintenance

(1) Develop the habit of regularly sampling the capacity of the electrolytic capacitor in the blind and buried-hole circuit board. If the capacity of the electrolytic capacitor is found to be less than 20% of the nominal capacity during the sampling process, it should be replaced in time. Under normal circumstances, it is recommended to replace the electrolytic capacitors in about ten years.

(2) For high-power devices coated with heat-dissipating grease, in order to prevent the high-power devices in the circuit board from being burned out due to poor heat dissipation, check whether the heat-dissipating grease is completely dry. For dry high-power devices, Apply new thermal grease again.

(3) The dust passing through the circuit board should be cleaned up in time to prevent dust from accumulating on the surface of the circuit board and affecting the normal operation of the components.