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Maintenance of blind and buried vias circuit boards

Maintenance of blind and buried vias circuit boards

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  • Time of issue:2020-12-10 13:05
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Maintenance of blind and buried vias circuit boards

Information

Blind and buried via circuit boards are also called HDI boards and are usually used in mobile phones, GPS navigation and other high-end products. The structure of a conventional multi-layer circuit board includes an inner layer circuit and an outer layer circuit, and then a process of drilling and metallization in the hole is used to realize the connection function between the inner layers of the circuits. With the development of electronic products to high density and high precision, the same requirements are put forward for circuit boards.

It is difficult to copy boards for blind buried vias. Usually, blind buried vias are encountered when copying boards on mobile phone boards and HDI boards. At this time, please pay attention to the following points:

1. Please be careful and be prepared before copying the board.

2. The equipment must be advanced.

3. In the process of copying the board, compare it with the original board.

4. Pay attention to check and check repeatedly.

In order to ensure the working conditions and reduce the failure rate of the circuit board, we need to maintain the blind buried via circuit board. The maintenance method can be divided into semi-maintenance and annual maintenance.

1. Semi-maintenance

(1) Clean the dust on the blind and buried via circuit boards quarterly. It can be cleaned with a special cleaning fluid for the circuit board. After the dust on the blind buried via circuit board is cleaned up, use a blower to dry it.

(2) Observe whether the electronic components on the blind buried via circuit board have high temperature traces and whether the electrolytic capacitors are bulging and leaking. If problems are found during the inspection process, they should be replaced in time.

2. Annual maintenance

(1) Develop the habit of regularly sampling the capacity of the electrolytic capacitor in the blind and buried-hole circuit board. If the capacity of the electrolytic capacitor is found to be less than 20% of the nominal capacity during the sampling process, it should be replaced in time. Under normal circumstances, it is recommended to replace the electrolytic capacitors in about ten years.

(2) For high-power devices coated with heat-dissipating grease, in order to prevent the high-power devices in the circuit board from being burned out due to poor heat dissipation, check whether the heat-dissipating grease is completely dry. For dry high-power devices, Apply new thermal grease again.

(3) The dust passing through the circuit board should be cleaned up in time to prevent dust from accumulating on the surface of the circuit board and affecting the normal operation of the components.

Keyword:

The evaluation system of the circuit board factory should follow the following principles

The evaluation system of the circuit board factory should follow the following principles

Establishing a good cooperative relationship with circuit board factories is conducive to cost reduction, response time reduction and the creation of new market value, etc. The core issue is how to choose the ideal circuit board factory. There are many factors involved in the evaluation of circuit board factories, and the evaluation index systems are diverse, both qualitative and quantitative, and the index weights are also different. Therefore, it is necessary to establish a universal and expandable evaluation index system for circuit board factories. , And the indicator system should follow the following principles:
The use of soft and hard circuit boards?

The use of soft and hard circuit boards?

In our daily life, circuit boards are mostly single-sided, double-sided, or multi-layer boards, rigid boards, metal-based circuit boards, aluminum, copper substrates, thermally conductive fiberboards, etc., do you know what a flexible and rigid circuit board is? Rigid-flex circuit board: refers to a special circuit board made by pressing a rigid circuit board (PCB) and a flexible circuit board (FPC). The main board materials used are rigid board FR4 and flexible board polyimide (PI). Rigid and flexible circuit boards combine the rigid characteristics of rigid circuit boards and the advantages of flexible circuit
Soft and hard circuit board production process

Soft and hard circuit board production process

The flexible and hard circuit board is the flexible circuit board and the rigid circuit board. After pressing and other processes, they are combined according to the relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. In the past, two hard boards were connected by using soft boards and connectors to connect each other. In order to improve the reliability of the connection between the rigid board and the flexible board, the flexible board is directly fabricated between two rigid boards in the printed circuit board (PCB) factory, which can avoid the subsequent connection process, whether it is a rigid board manufacturer or FPC manufacturers are now able to supply rigid-flex boards. Under the demand for light and thin end products, the

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