Multilayer circuit boards are essential electronic components in the field of electronic product processing. Generally, multi-layer circuit board factories have specific processing technologies for various types of boards. So what factors need to be considered in the manufacture of multilayer circuit boards? The following is a detailed introduction of Hengkesheng Electronics Co., Ltd.

1. Setting up the production environment

The environment of the multi-layer circuit board processing workshop is a very important aspect, and the adjustment of the ambient temperature and ambient humidity is the key. If the ambient temperature changes too much, it may cause the drill holes on the substrate to break. If the environmental humidity is too high, nuclear energy will have a negative impact on the performance of the water-absorbent substrate, which manifests itself as dielectric properties. Therefore, in the processing and production of multilayer circuit boards, it is necessary to maintain proper environmental conditions.

2. Choose the substrate

The substrates of multilayer circuit boards can be divided into two categories: organic substrates and inorganic substrates. Each substrate has its own unique advantages. The determination of the substrate type should consider various dielectric properties, the type of copper foil, the thickness of the base groove, and the workability. Among these materials, the surface thickness of copper foil is a key factor affecting its performance. Generally speaking, the thinner the thickness, the easier the etching, and the more advantageous it is to improve the accuracy of the pattern.

3. Consider the choice of process flow

The production of multi-layer circuit boards is easily affected by many factors. The number of processing layers, punching technology, surface coating treatment and other processes will affect the quality of the finished multi-layer circuit boards. Therefore, for these process environments, the processing and production of multilayer circuit boards are fully considered in combination with the characteristics of production equipment, and can be flexibly adjusted according to the type and processing requirements of the PCB.

Therefore, it is necessary to consider the choice of substrate, the setting of the production environment and the choice of process flow when manufacturing multilayer circuit boards. At the same time, the processing and blanking methods of PCB circuit board engineering materials are also an aspect that needs to be carefully selected, which is closely related to the smoothness of the finished product.