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What factors need to be considered in the processing and production of multilayer circuit boards?

What factors need to be considered in the processing and production of multilayer circuit boards?

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  • Time of issue:2020-11-25 17:08
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What factors need to be considered in the processing and production of multilayer circuit boards?

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Multilayer circuit boards are essential electronic components in the field of electronic product processing. Generally, multi-layer circuit board factories have specific processing technologies for various types of boards. So what factors need to be considered in the manufacture of multilayer circuit boards? The following is a detailed introduction of Hengkesheng Electronics Co., Ltd.

1. Setting up the production environment

The environment of the multi-layer circuit board processing workshop is a very important aspect, and the adjustment of the ambient temperature and ambient humidity is the key. If the ambient temperature changes too much, it may cause the drill holes on the substrate to break. If the environmental humidity is too high, nuclear energy will have a negative impact on the performance of the water-absorbent substrate, which manifests itself as dielectric properties. Therefore, in the processing and production of multilayer circuit boards, it is necessary to maintain proper environmental conditions.

2. Choose the substrate

The substrates of multilayer circuit boards can be divided into two categories: organic substrates and inorganic substrates. Each substrate has its own unique advantages. The determination of the substrate type should consider various dielectric properties, the type of copper foil, the thickness of the base groove, and the workability. Among these materials, the surface thickness of copper foil is a key factor affecting its performance. Generally speaking, the thinner the thickness, the easier the etching, and the more advantageous it is to improve the accuracy of the pattern.

3. Consider the choice of process flow

The production of multi-layer circuit boards is easily affected by many factors. The number of processing layers, punching technology, surface coating treatment and other processes will affect the quality of the finished multi-layer circuit boards. Therefore, for these process environments, the processing and production of multilayer circuit boards are fully considered in combination with the characteristics of production equipment, and can be flexibly adjusted according to the type and processing requirements of the PCB.

Therefore, it is necessary to consider the choice of substrate, the setting of the production environment and the choice of process flow when manufacturing multilayer circuit boards. At the same time, the processing and blanking methods of PCB circuit board engineering materials are also an aspect that needs to be carefully selected, which is closely related to the smoothness of the finished product.

Keyword:

The evaluation system of the circuit board factory should follow the following principles

The evaluation system of the circuit board factory should follow the following principles

Establishing a good cooperative relationship with circuit board factories is conducive to cost reduction, response time reduction and the creation of new market value, etc. The core issue is how to choose the ideal circuit board factory. There are many factors involved in the evaluation of circuit board factories, and the evaluation index systems are diverse, both qualitative and quantitative, and the index weights are also different. Therefore, it is necessary to establish a universal and expandable evaluation index system for circuit board factories. , And the indicator system should follow the following principles:
The use of soft and hard circuit boards?

The use of soft and hard circuit boards?

In our daily life, circuit boards are mostly single-sided, double-sided, or multi-layer boards, rigid boards, metal-based circuit boards, aluminum, copper substrates, thermally conductive fiberboards, etc., do you know what a flexible and rigid circuit board is? Rigid-flex circuit board: refers to a special circuit board made by pressing a rigid circuit board (PCB) and a flexible circuit board (FPC). The main board materials used are rigid board FR4 and flexible board polyimide (PI). Rigid and flexible circuit boards combine the rigid characteristics of rigid circuit boards and the advantages of flexible circuit
Soft and hard circuit board production process

Soft and hard circuit board production process

The flexible and hard circuit board is the flexible circuit board and the rigid circuit board. After pressing and other processes, they are combined according to the relevant process requirements to form a circuit board with FPC characteristics and PCB characteristics. In the past, two hard boards were connected by using soft boards and connectors to connect each other. In order to improve the reliability of the connection between the rigid board and the flexible board, the flexible board is directly fabricated between two rigid boards in the printed circuit board (PCB) factory, which can avoid the subsequent connection process, whether it is a rigid board manufacturer or FPC manufacturers are now able to supply rigid-flex boards. Under the demand for light and thin end products, the

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