What factors need to be considered in the processing and production of multilayer circuit boards?
Multi-layer circuit board is an essential and important electronic component in the field of electronic product processing. Generally, multilayer circuit board factories have specific processing technologies for various types of boards. So what factors need to be considered in the manufacture of multilayer circuit boards? The following is a detailed introduction of Hengke Sheng Electronics Co., Ltd.
1. The setting of the production environment
The environment of the multi-layer circuit board processing workshop is a very important aspect, and the adjustment of the ambient temperature and ambient humidity is the key. If the ambient temperature changes too much, it may cause the drill hole on the substrate to crack. If the ambient humidity is too high, nuclear energy will have a negative impact on the performance of the water-absorbing substrate, which is manifested as dielectric properties. Therefore, in the processing and production of multilayer wiring board , it is necessary to maintain appropriate environmental conditions.
2. Select Substrate
The substrates of multilayer circuit boards can be divided into two categories: organic substrates and inorganic substrates. Each substrate has its unique advantages. The determination of the substrate type should consider various dielectric properties, copper foil type, base groove thickness, processability, etc. In these materials, the surface thickness of the copper foil is a key factor affecting its performance. Generally speaking, the thinner the thickness, the more convenient the etching, and the more advantageous it is to improve the accuracy of the pattern.
3. Consider the choice of process flow
The production of multi-layer circuit board is easily affected by many factors. The number of processing layers, punching technology, surface coating treatment and other processes will affect the quality of the finished multi-layer circuit board. Therefore, for these process environments, the processing and production of multi-layer circuit boards are fully considered in combination with the characteristics of the production equipment, and can be flexibly adjusted according to the type and processing requirements of the PCB board. Therefore, when manufacturing multilayer circuit board
, it is necessary to consider the selection of the substrate, the setting of the production environment and the selection of the process flow. At the same time, the processing and blanking methods of PCB engineering materials are also an aspect that needs to be carefully selected, which is closely related to the smoothness of the finished product.
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