Multi-layer circuit board factory: the manufacturer's plate making ability
I don't know if you have noticed that on the websites of most multilayer circuit board factories, we always see the "processing power" column, which seems to indicate the strength of the multilayer circuit board factory. Out of the curiosity of melon eaters, what factors determine the processing capacity of a multi-layer circuit board factory?
1. Number of layers and number of boards
Attention should be paid to the maximum number of layers, surface treatment process, thickness range of boards, thickness tolerance of boards and types of boards. At the same time, appropriate design software should be used to ensure the quality of PCB multi-layer circuit board factory production.
Combine these aspects with each other. If the final display of the circuit board is exquisite, it means that the multilayer circuit board factory has a higher processing capacity and can ensure the quality of the circuit board.
2. Line drawing
Line type includes minimum line width and line spacing, minimum network line width and line spacing, minimum etching font width, minimum BGA and pad, internal and external copper thickness of the finished product, and spacing and contour between traces. Only by understanding and being familiar with these parameters can we obtain high-quality circuit graphics.
3. Drilling and modeling
The details that should be paid attention to when drilling are the same as the line type mentioned in the first point. In terms of shape, attention should be paid to the smallest slotting knife, maximum size and V-CUT to ensure that the shape is complete and clean.
4. Characters and Craft
In terms of characters, the minimum character width, height, line width and patch character frame distance, and solder resist layer spacing should be mastered; attention should be paid to peel strength, flame retardancy, resistance type and special process during processing.
5. Solder mask and puzzle
There are many types of solder mask. Solder mask bridging should be familiar with the design spacing between pads. For PCB layout, you should pay attention to the gap problem, and be familiar with the PCB half-plate layout rules and various types of assembly and delivery.
multilayer circuit board factory
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Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
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Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
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In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
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Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.
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