The company's "safe production month" series of activities started
On November 1, Hengkesheng Electronics held the "Safety Production Month" kick-off meeting and the safety production management committee meeting in the fourth quarter of 2018.
At the kick-off meeting, Li Jian, the general manager of the company, took "life first, safe development" as the theme, combined with internal and external case analysis, explained to the participants and emphasized the importance of "party and government with the same responsibility, one post with two responsibilities. Li Jian asked the principal responsible persons of all departments and processes of Shenzhen and Qingyuan companies to sound the "alarm bell" and strictly perform the "double responsibilities of one post". Safety Director Luo Jinheng analyzed the current severe safety situation and reminded everyone to fully implement the three-level safety education and all-staff re-education work, and safety management personnel at all levels should do a good job in improving personal safety management quality and making breakthroughs in safety technical capabilities. Safety is the "red line" of the company and must be carried out in an all-round way; the management of the "four new" safety work should be strengthened, and the safety production month should be taken as an opportunity to quickly improve the weak links in on-site management. After the
meeting, Li Jian led the team to focus on the inspection of the distribution areas of important hazard sources in the production sites of the two places, and conducted on-site tests on the three-level linkage emergency response capability of the two places. During the inspection, Li Jian affirmed the emergency response capability of Qingyuan Company to defend the fire brigade. He encouraged Shenzhen and Qingyuan Company to strengthen technical communication and learning exchanges, strengthen the linkage and common improvement of the two places, and create a solid safety emergency defense line for the company.
Previous Page
The circuit board factory talks about the application advantage analysis of FPC in wearable devices.
2023-07-28
The FPC mentioned by the editor of the circuit board factory has excellent performance and plays an indispensable role in electronic products, meeting the development needs of smart phones and smart wearable devices. With the trend of miniaturization and thinning of electronic products, the consumption of FPC flexible circuit boards is increasing and booming.
Multi-layer circuit board factory-multi-layer circuit board compatible design points description.
2023-07-28
Most electronic products are inseparable from the component is multilayer circuit board, and the production quality of multilayer circuit board factory directly determines the use of electronic equipment and the use of quality, there are many points in the circuit board processing related to the compatibility of multilayer circuit board, and then affect the quality of the circuit board. What are the main points of the compatibility design of multilayer circuit boards under the popular science?_multilayer circuit board_multilayer circuit board factory_blind buried hole circuit board_HDI board proofing
2023-07-28
In the graphic electroplating process method of multi-layer circuit board factory, because the circuit pattern is easy to produce side etching in the etching process, the tin-lead alloy plating part is in the air and produces a suspension layer, which is easy to fall off, resulting in a short circuit caused by bridging between wires. Multilayer circuit board factory uses infrared hot melt process method, can make the exposed copper surface get very good protection. However, when it is used for infrared thermal melting of multi-layer circuit boards, the phenomenon of delamination and foaming between layers of multi-layer circuit boards is very serious due to high temperature, resulting in a very low yield of multi-layer circuit boards. _Blind buried hole circuit board_multilayer circuit board
2023-07-28
Before designing multilayer circuit boards, the multilayer circuit board structure must be determined according to the circuit scale, circuit board size and electromagnetic compatibility (EMC) requirements. That is to decide whether to use a 4-layer, 6-layer or higher multilayer circuit board. Once the number of layers is determined, the multilayer circuit board factory has decided to determine the placement of the electrical layers in the multilayer circuit board and how to distribute different signals on these layers. This is the choice of multilayer circuit board factory laminated structure.